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ADSP-2181BS-133 — MICROCIRCUIT,MEMORY

✓ Government record, cited
— · COMPONENT
PRODUCT OVERVIEW

ADSP-2181BS-133: MICROCIRCUIT,MEMORY.

The MICROCIRCUIT,MEMORY is a the manufacturer memory module engineered for enterprise server and workstation platforms requiring validated, high-reliability memory. Key specifications include inclosure_material: PLASTIC, memory_device_type: RAM, storage_temp_range: -65.0 TO 150.0 CELSIUS DEGC, operating_temp_range: -40.0 TO 85.0 CELSIUS DEGC, end_item_identification: SCOPE SHIELD E/I FSCM 23386, inclosure_configuration: FLAT PACK. This part is cataloged in the U.S.

Government catalog under NSN 5962-01-451-2251, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.

Verify compatibility with your specific system configuration before ordering.

WHERE IT FITS
ADSP-2181BS-133
NSN: 5962-01-451-2251
FSC: 5962 — Microcircuits, Electronic
CAGE: 06665 — ANALOG DEVICES, INC. DIV SANTA CLARA SITE (USA)
SPECIFICATIONS
inclosure_materialPLASTIC
memory_device_typeRAM
storage_temp_range-65.0 TO 150.0 CELSIUS DEGC
operating_temp_range-40.0 TO 85.0 CELSIUS DEGC
end_item_identificationSCOPE SHIELD E/I FSCM 23386
inclosure_configurationFLAT PACK
terminal_type_and_quantity128 FLAT LEADS
part_name_assigned_by_controlling_agency16K DIGITAL SIGNAL PROCESSING MICROCOMPUTER
voltage_rating_and_type_per_characteristic5.0 VOLTS MAXIMUM INPUT
NSN5962-01-451-2251
COMPONENT DIAGRAM
COMPONENT MAIN IC EDGE CONNECTOR No detailed specs available MICROCIRCUIT,MEMORY TITLE COMPONENT PN ADSP-2181BS-133 MFR MICROCIRCUIT,MEMORY
KEY FEATURES
•
INCLOSURE MATERIAL: PLASTIC
•
INCLOSURE CONFIGURATION: FLAT PACK
•
MEMORY DEVICE TYPE: RAM
•
STORAGE TEMP RANGE: -65.0 TO 150.0 CELSIUS DEGC
•
VOLTAGE RATING AND TYPE PER CHARACTERISTIC: 5.0 VOLTS MAXIMUM INPUT
•
OPERATING TEMP RANGE: -40.0 TO 85.0 CELSIUS DEGC
TYPICAL APPLICATIONS
  • Server memory expansion for virtualization workloads
  • Database performance optimization (in-memory computing)
  • VDI and remote desktop session hosting
  • High-performance computing (HPC) clusters
  • Mail server and collaboration platform scaling
  • Application server tier expansion
TECHNICAL CHARACTERISTICS
INCLOSURE MATERIALPLASTIC
INCLOSURE CONFIGURATIONFLAT PACK
MEMORY DEVICE TYPERAM
STORAGE TEMP RANGE-65.0 TO 150.0 CELSIUS DEGC
VOLTAGE RATING AND TYPE PER CHARACTERISTIC5.0 VOLTS MAXIMUM INPUT
OPERATING TEMP RANGE-40.0 TO 85.0 CELSIUS DEGC
PART NAME ASSIGNED BY CONTROLLING AGENCY16K DIGITAL SIGNAL PROCESSING MICROCOMPUTER
END ITEM IDENTIFICATIONSCOPE SHIELD E/I FSCM 23386
TERMINAL TYPE AND QUANTITY128 FLAT LEADS
SUBSTITUTES & CROSS-REFERENCES 1
365477Reference document
Same NSN cross-reference
Reference document — Secondary reference
LIFECYCLE
NSN statusActive· U.S. Government catalog
Acquisition advice: Insurance item — stocked against contingency demandDemilitarization required — mutilation + specific procedure
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FREQUENTLY ASKED QUESTIONS
What is ADSP-2181BS-133?
ADSP-2181BS-133 is a MICROCIRCUIT,MEMORY.
What parts can replace ADSP-2181BS-133?
There is 1 known substitute for ADSP-2181BS-133: 365477. Substitute compatibility should be verified for your specific system.
What is the NSN for ADSP-2181BS-133?
ADSP-2181BS-133 is cataloged in the U.S. Government catalog under NSN 5962-01-451-2251. This indicates validated use in U.S. government and defense supply chains.
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