AD584TE/883B — MICROCIRCUIT,LINEAR

✓ Government record, cited

— · COMPONENT

PRODUCT OVERVIEW

AD584TE/883B: MICROCIRCUIT,LINEAR.

The MICROCIRCUIT,LINEAR is a the manufacturer industrial component. Key specifications include body_width: 0.358 INCHES MAXIMUM IN, body_height: 0.100 INCHES MAXIMUM IN, body_length: 0.358 INCHES MAXIMUM IN, features_provided: MONOLITHIC AND POSITIVE OUTPUTS, inclosure_material: CERAMIC, storage_temp_range: -65.0 TO 150.0 CELSIUS DEGC. This part is cataloged in the U.S.

Government catalog under NSN 5962-01-274-9446, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.

Verify compatibility with your specific system configuration before ordering.

WHERE IT FITS

AD584TE/883B

NSN: 5962-01-274-9446
NIINs: 012749446, 013149702
FSC: 5962 — Microcircuits, Electronic
CAGE: 24355 — ANALOG DEVICES, INC. DIV CORPORATE HEADQUARTERS (USA)

SPECIFICATIONS

body_width	0.358 INCHES MAXIMUM IN
body_height	0.100 INCHES MAXIMUM IN
body_length	0.358 INCHES MAXIMUM IN
features_provided	MONOLITHIC AND POSITIVE OUTPUTS
inclosure_material	CERAMIC
storage_temp_range	-65.0 TO 150.0 CELSIUS DEGC
test_data_document	96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.).
operating_temp_range	-55.0 TO 125.0 CELSIUS DEGC
input_circuit_pattern	4 INPUT
inclosure_configuration	LEADLESS FLAT PACK
terminal_surface_treatment	SOLDER
terminal_type_and_quantity	20 LEADLESS
NSN	5962-01-274-9446

COMPONENT DIAGRAM

KEY FEATURES

•

INPUT CIRCUIT PATTERN: 1 INPUT

•

INCLOSURE MATERIAL: CERAMIC OR METAL

•

TERMINAL SURFACE TREATMENT: SOLDER

•

DESIGN FUNCTION AND QUANTITY: 1 REFERENCE, VOLTAGE, ANALOG

•

BODY WIDTH: 0.342 INCHES MINIMUM AND 0.358 INCHES MAXIMUM IN

•

BODY HEIGHT: 0.064 INCHES MINIMUM AND 0.100 INCHES MAXIMUM IN

•

FEATURES PROVIDED: ELECTROSTATIC SENSITIVE AND HERMETICALLY SEALED AND W/STROBE

•

INCLOSURE CONFIGURATION: LEADLESS FLAT PACK

TECHNICAL CHARACTERISTICS

INPUT CIRCUIT PATTERN	1 INPUT
INCLOSURE MATERIAL	CERAMIC OR METAL
TERMINAL SURFACE TREATMENT	SOLDER
DESIGN FUNCTION AND QUANTITY	1 REFERENCE, VOLTAGE, ANALOG
BODY WIDTH	0.342 INCHES MINIMUM AND 0.358 INCHES MAXIMUM IN
BODY HEIGHT	0.064 INCHES MINIMUM AND 0.100 INCHES MAXIMUM IN
FEATURES PROVIDED	ELECTROSTATIC SENSITIVE AND HERMETICALLY SEALED AND W/STROBE
INCLOSURE CONFIGURATION	LEADLESS FLAT PACK
BODY LENGTH	0.342 INCHES MINIMUM AND 0.358 INCHES MAXIMUM IN
STORAGE TEMP RANGE	-65.0 TO 150.0 CELSIUS DEGC

SUBSTITUTES & CROSS-REFERENCES 2

10133594Reference document

Same NSN cross-reference

Reference document — Informative reference only

AD584LNReference document

Same NSN cross-reference

Reference document — Advisory reference — outside the item-of-supply concept

LIFECYCLE

NSN statusActive· U.S. Government catalog

Acquisition advice: Insurance item — stocked against contingency demandDemilitarization required — mutilation + specific procedure

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FREQUENTLY ASKED QUESTIONS

What is AD584TE/883B?

AD584TE/883B is a MICROCIRCUIT,LINEAR.

What parts can replace AD584TE/883B?

There are 2 known substitutes for AD584TE/883B: 10133594, AD584LN. Substitute compatibility should be verified for your specific system.

What is the NSN for AD584TE/883B?

AD584TE/883B is cataloged in the U.S. Government catalog under NSN 5962-01-274-9446. This indicates validated use in U.S. government and defense supply chains.

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