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Technical Data Sheet

AB/1/30/5822 — MICROCIRCUIT,DIGITAL

✓ Government record, cited
— · COMPONENT
PRODUCT OVERVIEW

AB/1/30/5822: MICROCIRCUIT,DIGITAL.

The MICROCIRCUIT,DIGITAL is a the manufacturer industrial component. Key specifications include body_width: 5.59 MILLIMETERS NOMINAL MM, body_height: 4.7 MILLIMETERS MAXIMUM MM, body_length: 32.77 MILLIMETERS MAXIMUM MM, features_provided: BURN IN, MIL-STD-883, CLASS B, output_logic_form: TRANSISTOR-TRANSISTOR LOGIC, inclosure_material: CERAMIC. This part is cataloged in the U.S.

Government catalog under NSN 5962-01-208-4205, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.

Verify compatibility with your specific system configuration before ordering.

WHERE IT FITS
AB/1/30/5822
NSN: 5962-01-208-4205
FSC: 5962 — Microcircuits, Electronic
CAGE: K4244 — BAE SYSTEMS GCS INTERNATIONAL LTD (GBR)
SPECIFICATIONS
body_width5.59 MILLIMETERS NOMINAL MM
body_height4.7 MILLIMETERS MAXIMUM MM
body_length32.77 MILLIMETERS MAXIMUM MM
features_providedBURN IN, MIL-STD-883, CLASS B
output_logic_formTRANSISTOR-TRANSISTOR LOGIC
inclosure_materialCERAMIC
operating_temp_range-55.0 TO 125.0 CELSIUS DEGC
inclosure_configurationDUAL-IN-LINE
design_function_and_quantity4 ARRAY, LOGIC
NSN5962-01-208-4205
COMPONENT DIAGRAM
COMPONENT MAIN IC EDGE CONNECTOR No detailed specs available MICROCIRCUIT,DIGITAL TITLE COMPONENT PN AB/1/30/5822 MFR MICROCIRCUIT,DIGITAL
KEY FEATURES
•
INCLOSURE MATERIAL: CERAMIC
•
DESIGN FUNCTION AND QUANTITY: 4 ARRAY, LOGIC
•
BODY WIDTH: 5.59 MILLIMETERS NOMINAL MM
•
BODY HEIGHT: 4.7 MILLIMETERS MAXIMUM MM
•
FEATURES PROVIDED: BURN IN, MIL-STD-883, CLASS B
•
INCLOSURE CONFIGURATION: DUAL-IN-LINE
•
BODY LENGTH: 32.77 MILLIMETERS MAXIMUM MM
•
OUTPUT LOGIC FORM: TRANSISTOR-TRANSISTOR LOGIC
TECHNICAL CHARACTERISTICS
INCLOSURE MATERIALCERAMIC
DESIGN FUNCTION AND QUANTITY4 ARRAY, LOGIC
BODY WIDTH5.59 MILLIMETERS NOMINAL MM
BODY HEIGHT4.7 MILLIMETERS MAXIMUM MM
FEATURES PROVIDEDBURN IN, MIL-STD-883, CLASS B
INCLOSURE CONFIGURATIONDUAL-IN-LINE
BODY LENGTH32.77 MILLIMETERS MAXIMUM MM
OUTPUT LOGIC FORMTRANSISTOR-TRANSISTOR LOGIC
OPERATING TEMP RANGE-55.0 TO 125.0 CELSIUS DEGC
SUBSTITUTES & CROSS-REFERENCES 6
PAL20X4AMJS883BReference document
Same NSN cross-reference
Reference document — Design control — primary reference
A17446Same NSN cross-reference
Same NSN cross-reference
Also cataloged under this NSN
ROM/PROM HEAD 080Reference document
Same NSN cross-reference
Reference document — Secondary reference
9430-00049Same NSN cross-reference
Same NSN cross-reference
Also cataloged under this NSN
PAL20X4MJS/883BReference document
Same NSN cross-reference
Reference document — Secondary reference
PAL20X4MJ/883BReference document
Same NSN cross-reference
Reference document — Secondary reference
LIFECYCLE
NSN statusActive· U.S. Government catalog
Acquisition advice: Terminal item — stock exhausted; no further procurementDemilitarization required — critical (Q)
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FREQUENTLY ASKED QUESTIONS
What is AB/1/30/5822?
AB/1/30/5822 is a MICROCIRCUIT,DIGITAL.
What parts can replace AB/1/30/5822?
There are 6 known substitutes for AB/1/30/5822: PAL20X4AMJS883B, A17446, ROM/PROM HEAD 080 and 3 more. Substitute compatibility should be verified for your specific system.
What is the NSN for AB/1/30/5822?
AB/1/30/5822 is cataloged in the U.S. Government catalog under NSN 5962-01-208-4205. This indicates validated use in U.S. government and defense supply chains.
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