The TRANSFORMER,RADIO FREQUENCY is a the manufacturer industrial component. Key specifications include material: SILICON SEMICONDUCTOR, overall_length: 0.205 INCHES MAXIMUM IN, mounting_method: TERMINAL, terminal_length: 1.100 INCHES MINIMUM IN, overall_diameter: 0.100 INCHES MINIMUM AND 0.107 INCHES MAXIMUM IN, features_provided: HERMETICALLY SEALED CASE. This part is cataloged in the Federal Logistics Information System (FLIS) under NSN 5961-00-018-9195, indicating validated use in U.S.
government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels. Verify compatibility with your specific system configuration before ordering.
| material | SILICON SEMICONDUCTOR |
| overall_length | 0.205 INCHES MAXIMUM IN |
| mounting_method | TERMINAL |
| terminal_length | 1.100 INCHES MINIMUM IN |
| overall_diameter | 0.100 INCHES MINIMUM AND 0.107 INCHES MAXIMUM IN |
| features_provided | HERMETICALLY SEALED CASE |
| terminal_type_and_quantity | 2 UNINSULATED WIRE LEAD |
| specification/standard_data | 80131-RELEASE5009 PROFESSIONAL/INDUSTRIAL ASSOCIATION SPECIFICATION |
| power_rating_per_characteristic | 1.0 WATTS MAXIMUM TOTAL POWER DISSIPATION |
| current_rating_per_characteristic | 21.00 MILLIAMPERES MAXIMUM MAXIMUM REVERSE SURGE CURRENT |
| voltage_rating_in_volts_per_characteristic | 12.0 MAXIMUM NOMINAL REGULATOR VOLTAGE |
| maximum_operating_temp_per_measurement_point | 200.0 CELSIUS AMBIENT AIR DEGC |
| NSN | 5961-00-018-9195 |
| MOUNTING METHOD | TERMINAL |
| VOLTAGE RATING IN VOLTS PER CHARACTERISTIC | 12.0 MAXIMUM NOMINAL REGULATOR VOLTAGE |
| TERMINAL LENGTH | 1.100 INCHES MINIMUM IN |
| FEATURES PROVIDED | HERMETICALLY SEALED CASE |
| OVERALL LENGTH | 0.205 INCHES MAXIMUM IN |
| OVERALL DIAMETER | 0.100 INCHES MINIMUM AND 0.107 INCHES MAXIMUM IN |
| MAXIMUM OPERATING TEMP PER MEASUREMENT POINT | 200.0 CELSIUS AMBIENT AIR DEGC |
| CURRENT RATING PER CHARACTERISTIC | 21.00 MILLIAMPERES MAXIMUM MAXIMUM REVERSE SURGE CURRENT |
| MATERIAL | GLASS ENCLOSURE |
| MATERIAL | SILICON SEMICONDUCTOR |