A584A180-104: MICROCIRCUIT,HYBRID.
The MICROCIRCUIT,HYBRID is a the manufacturer industrial component. Key specifications include body_width: 1.790 INCHES MAXIMUM IN, body_height: 0.170 INCHES MAXIMUM IN, body_length: 1.190 INCHES MAXIMUM IN, overall_length: 2.190 INCHES MINIMUM AND 4.190 INCHES MAXIMUM IN, features_provided: MONOLITHIC AND W/HEAT SINK AND BURN IN, output_logic_form: TRANSISTOR-TRANSISTOR LOGIC. This part is cataloged in the U.S.
Government catalog under NSN 5962-01-282-7796, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.
Verify compatibility with your specific system configuration before ordering.
| body_width | 1.790 INCHES MAXIMUM IN |
| body_height | 0.170 INCHES MAXIMUM IN |
| body_length | 1.190 INCHES MAXIMUM IN |
| overall_length | 2.190 INCHES MINIMUM AND 4.190 INCHES MAXIMUM IN |
| features_provided | MONOLITHIC AND W/HEAT SINK AND BURN IN |
| output_logic_form | TRANSISTOR-TRANSISTOR LOGIC |
| inclosure_material | CERAMIC |
| storage_temp_range | -65.0 TO 150.0 CELSIUS DEGC |
| operating_temp_range | -55.0 TO 100.0 CELSIUS DEGC |
| hybrid_technology_type | MONOLITHIC |
| inclosure_configuration | FLAT PACK |
| terminal_surface_treatment | SOLDER |
| NSN | 5962-01-282-7796 |
| HYBRID TECHNOLOGY TYPE | MONOLITHIC |
| INCLOSURE MATERIAL | CERAMIC |
| TERMINAL SURFACE TREATMENT | SOLDER |
| DESIGN FUNCTION AND QUANTITY | 1 AMPLIFIER, BUFFER |
| BODY WIDTH | 1.790 INCHES MAXIMUM IN |
| BODY HEIGHT | 0.170 INCHES MAXIMUM IN |
| OVERALL LENGTH | 2.190 INCHES MINIMUM AND 4.190 INCHES MAXIMUM IN |
| FEATURES PROVIDED | MONOLITHIC AND W/HEAT SINK AND BURN IN |
| INCLOSURE CONFIGURATION | FLAT PACK |
| BODY LENGTH | 1.190 INCHES MAXIMUM IN |