The MICROCIRCUIT,DIGITAL is a the manufacturer industrial component. Key specifications include body_width: 0.280 INCHES NOMINAL IN, body_height: 0.180 INCHES NOMINAL IN, body_length: 0.755 INCHES MINIMUM AND 0.785 INCHES MAXIMUM IN, special_features: MIL-STD-883 CLASS B REQUIREMENTS, features_provided: HERMETICALLY SEALED AND W/OPEN COLLECTOR, output_logic_form: TRANSISTOR-TRANSISTOR LOGIC. This part is cataloged in the Federal Logistics Information System (FLIS) under NSN 5962-00-162-7507, indicating validated use in U.S.
government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels. Verify compatibility with your specific system configuration before ordering.
| body_width | 0.280 INCHES NOMINAL IN |
| body_height | 0.180 INCHES NOMINAL IN |
| body_length | 0.755 INCHES MINIMUM AND 0.785 INCHES MAXIMUM IN |
| special_features | MIL-STD-883 CLASS B REQUIREMENTS |
| features_provided | HERMETICALLY SEALED AND W/OPEN COLLECTOR |
| output_logic_form | TRANSISTOR-TRANSISTOR LOGIC |
| inclosure_material | CERAMIC |
| operating_temp_range | -55.0 TO 125.0 CELSIUS DEGC |
| input_circuit_pattern | HEX 1 INPUT |
| inclosure_configuration | DUAL-IN-LINE |
| design_function_and_quantity | 6 INVERTER |
| NSN | 5962-00-162-7507 |
| BODY LENGTH | 0.755 INCHES MINIMUM AND 0.785 INCHES MAXIMUM IN |
| OUTPUT LOGIC FORM | TRANSISTOR-TRANSISTOR LOGIC |
| INCLOSURE MATERIAL | CERAMIC |
| BODY HEIGHT | 0.180 INCHES NOMINAL IN |
| OPERATING TEMP RANGE | -55.0 TO 125.0 CELSIUS DEGC |
| DESIGN FUNCTION AND QUANTITY | 6 INVERTER |
| INCLOSURE CONFIGURATION | DUAL-IN-LINE |
| INPUT CIRCUIT PATTERN | HEX 1 INPUT |
| SPECIAL FEATURES | MIL-STD-883 CLASS B REQUIREMENTS |
| FEATURES PROVIDED | HERMETICALLY SEALED AND W/OPEN COLLECTOR |