The SEMICONDUCTOR DEVICE ASSEMBLY is a the manufacturer industrial component. Key specifications include overall_height: 4.000 INCHES NOMINAL IN, overall_length: 4.000 INCHES NOMINAL IN, major_components: DIODE 1; RECTIFIER 1; HEAT SINK 1, special_features: MTG HARDWARE. This product is currently in active production with full OEM support.
This part is cataloged in the Federal Logistics Information System (FLIS) under NSN 5961-00-232-8499, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.
Verify compatibility with your specific system configuration before ordering.
| overall_height | 4.000 INCHES NOMINAL IN |
| overall_length | 4.000 INCHES NOMINAL IN |
| major_components | DIODE 1; RECTIFIER 1; HEAT SINK 1 |
| special_features | MTG HARDWARE |
| NSN | 5961-00-232-8499 |
| OVERALL LENGTH | 4.000 INCHES NOMINAL IN |
| MAJOR COMPONENTS | DIODE 1; RECTIFIER 1; HEAT SINK 1 |
| OVERALL HEIGHT | 4.000 INCHES NOMINAL IN |
| SPECIAL FEATURES | MTG HARDWARE |