A3113554-001 — MICROCIRCUIT,MEMORY

✓ Government record, cited

— · COMPONENT

PRODUCT OVERVIEW

A3113554-001: MICROCIRCUIT,MEMORY.

The MICROCIRCUIT,MEMORY is a the manufacturer memory module engineered for enterprise server and workstation platforms requiring validated, high-reliability memory. Key specifications include features_provided: HERMETICALLY SEALED AND PROGRAMMED, inclosure_material: CERAMIC, memory_device_type: PAL, operating_temp_range: -55.0 TO 125.0 CELSIUS DEGC, inclosure_configuration: LEADED CHIP CARRIER, terminal_surface_treatment: SOLDER. This part is cataloged in the U.S.

Government catalog under NSN 5962-01-394-9422, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.

Verify compatibility with your specific system configuration before ordering.

WHERE IT FITS

A3113554-001

NSN: 5962-01-394-9422
FSC: 5962 — Microcircuits, Electronic
CAGE: 80063 — US ARMY COMMUNICATIONS & ELECTRONICS MATERIEL READINESS COMMAND LOGISTICS ENGINEERING DIR (USA)

SPECIFICATIONS

features_provided	HERMETICALLY SEALED AND PROGRAMMED
inclosure_material	CERAMIC
memory_device_type	PAL
operating_temp_range	-55.0 TO 125.0 CELSIUS DEGC
inclosure_configuration	LEADED CHIP CARRIER
terminal_surface_treatment	SOLDER
terminal_type_and_quantity	68 J-HOOK
time_rating_per_chacteristic	35.00 NANOSECONDS MAXIMUM ACCESS NS
voltage_rating_and_type_per_characteristic	7.0 VOLTS MAXIMUM POWER SOURCE
NSN	5962-01-394-9422

COMPONENT DIAGRAM

KEY FEATURES

•

INCLOSURE MATERIAL: CERAMIC

•

TERMINAL SURFACE TREATMENT: SOLDER

•

FEATURES PROVIDED: HERMETICALLY SEALED AND PROGRAMMED

•

INCLOSURE CONFIGURATION: LEADED CHIP CARRIER

•

MEMORY DEVICE TYPE: PAL

•

VOLTAGE RATING AND TYPE PER CHARACTERISTIC: 7.0 VOLTS MAXIMUM POWER SOURCE

•

OPERATING TEMP RANGE: -55.0 TO 125.0 CELSIUS DEGC

•

TERMINAL TYPE AND QUANTITY: 68 J-HOOK

TYPICAL APPLICATIONS

Server memory expansion for virtualization workloads
Database performance optimization (in-memory computing)
VDI and remote desktop session hosting
High-performance computing (HPC) clusters
Mail server and collaboration platform scaling
Application server tier expansion

TECHNICAL CHARACTERISTICS

INCLOSURE MATERIAL	CERAMIC
TERMINAL SURFACE TREATMENT	SOLDER
FEATURES PROVIDED	HERMETICALLY SEALED AND PROGRAMMED
INCLOSURE CONFIGURATION	LEADED CHIP CARRIER
MEMORY DEVICE TYPE	PAL
VOLTAGE RATING AND TYPE PER CHARACTERISTIC	7.0 VOLTS MAXIMUM POWER SOURCE
OPERATING TEMP RANGE	-55.0 TO 125.0 CELSIUS DEGC
TERMINAL TYPE AND QUANTITY	68 J-HOOK
TIME RATING PER CHACTERISTIC	35.00 NANOSECONDS MAXIMUM ACCESS NS

SUBSTITUTES & CROSS-REFERENCES 2

CY7C342-35HMBReference document

Same NSN cross-reference

Reference document — Secondary reference

ROM/PROMReference document

Same NSN cross-reference

Reference document — Secondary reference

LIFECYCLE

NSN statusActive· U.S. Government catalog

Acquisition advice: Insurance item — stocked against contingency demandDemilitarization required — critical (Q)

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FREQUENTLY ASKED QUESTIONS

What is A3113554-001?

A3113554-001 is a MICROCIRCUIT,MEMORY.

What parts can replace A3113554-001?

There are 2 known substitutes for A3113554-001: CY7C342-35HMB, ROM/PROM. Substitute compatibility should be verified for your specific system.

What is the NSN for A3113554-001?

A3113554-001 is cataloged in the U.S. Government catalog under NSN 5962-01-394-9422. This indicates validated use in U.S. government and defense supply chains.

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