Name: MICROCIRCUIT,MEMORY
Brand: Unknown
SKU: A3112753-001

A3112753-001 ✓ Verified by PartsTable

— · COMPONENT

WHAT YOU NEED TO KNOW

Verify manufacturer and server generation compatibility Check if Option PN or Spare PN — same part, different channel

Confirm exact part number — similar PNs may be different parts

PRODUCT OVERVIEW

The MICROCIRCUIT,MEMORY is a the manufacturer memory module engineered for enterprise server and workstation platforms requiring validated, high-reliability memory. Key specifications include features_provided: HERMETICALLY SEALED AND BURN IN AND PROGRAMMED, inclosure_material: CERAMIC, memory_device_type: ROM, test_data_document: 96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.)., operating_temp_range: -55.0 TO 125.0 CELSIUS DEGC, inclosure_configuration: DUAL-IN-LINE. This product is currently in active production with full OEM support.

This part is cataloged in the Federal Logistics Information System (FLIS) under NSN 5962-01-394-8388, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.

Verify compatibility with your specific system configuration before ordering.

WHERE IT FITS

A3112753-001

NSN: 5962-01-394-8388
FSC: 5962
CAGE: 80063 — US ARMY COMMUNICATIONS & ELECTRONICS MATERIEL READINESS COMMAND LOGISTICS ENGINEERING DIR (USA)

SPECIFICATIONS

features_provided	HERMETICALLY SEALED AND BURN IN AND PROGRAMMED
inclosure_material	CERAMIC
memory_device_type	ROM
test_data_document	96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.).
operating_temp_range	-55.0 TO 125.0 CELSIUS DEGC
inclosure_configuration	DUAL-IN-LINE
terminal_surface_treatment	SOLDER
terminal_type_and_quantity	28 PRINTED CIRCUIT
time_rating_per_chacteristic	250.00 NANOSECONDS MAXIMUM DELAY NS
voltage_rating_and_type_per_characteristic	7.0 VOLTS MAXIMUM POWER SOURCE
NSN	5962-01-394-8388

COMPONENT DIAGRAM

KEY FEATURES

•

INCLOSURE CONFIGURATION: DUAL-IN-LINE

•

FEATURES PROVIDED: HERMETICALLY SEALED AND BURN IN AND PROGRAMMED

•

TERMINAL SURFACE TREATMENT: SOLDER

•

TEST DATA DOCUMENT: 96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.).

•

TERMINAL TYPE AND QUANTITY: 28 PRINTED CIRCUIT

•

TIME RATING PER CHACTERISTIC: 250.00 NANOSECONDS MAXIMUM DELAY NS

•

MEMORY DEVICE TYPE: ROM

•

VOLTAGE RATING AND TYPE PER CHARACTERISTIC: 7.0 VOLTS MAXIMUM POWER SOURCE

TYPICAL APPLICATIONS

Server memory expansion for virtualization workloads
Database performance optimization (in-memory computing)
VDI and remote desktop session hosting
High-performance computing (HPC) clusters
Mail server and collaboration platform scaling
Application server tier expansion

TECHNICAL CHARACTERISTICS (FLIS)

INCLOSURE CONFIGURATION	DUAL-IN-LINE
FEATURES PROVIDED	HERMETICALLY SEALED AND BURN IN AND PROGRAMMED
TERMINAL SURFACE TREATMENT	SOLDER
TEST DATA DOCUMENT	96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.).
TERMINAL TYPE AND QUANTITY	28 PRINTED CIRCUIT
TIME RATING PER CHACTERISTIC	250.00 NANOSECONDS MAXIMUM DELAY NS
MEMORY DEVICE TYPE	ROM
VOLTAGE RATING AND TYPE PER CHARACTERISTIC	7.0 VOLTS MAXIMUM POWER SOURCE
OPERATING TEMP RANGE	-55.0 TO 125.0 CELSIUS DEGC
INCLOSURE MATERIAL	CERAMIC

VERIFIED SUBSTITUTES & CROSS-REFERENCES 17

10129525Interchangeable