The MICROCIRCUIT,MEMORY is a the manufacturer memory module engineered for enterprise server and workstation platforms requiring validated, high-reliability memory. Key specifications include inclosure_material: CERAMIC, memory_device_type: EPROM, operating_temp_range: -55.0 TO 125.0 CELSIUS DEGC, inclosure_configuration: DUAL-IN-LINE, terminal_surface_treatment: SOLDER, terminal_type_and_quantity: 28 PRINTED CIRCUIT. This product is currently in active production with full OEM support.
This part is cataloged in the Federal Logistics Information System (FLIS) under NSN 5962-01-412-6864, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.
Verify compatibility with your specific system configuration before ordering.
| inclosure_material | CERAMIC |
| memory_device_type | EPROM |
| operating_temp_range | -55.0 TO 125.0 CELSIUS DEGC |
| inclosure_configuration | DUAL-IN-LINE |
| terminal_surface_treatment | SOLDER |
| terminal_type_and_quantity | 28 PRINTED CIRCUIT |
| time_rating_per_chacteristic | 250.00 NANOSECONDS MAXIMUM ACCESS NS |
| part_name_assigned_by_controlling_agency | PROGRAMMED 32768 X 8 |
| voltage_rating_and_type_per_characteristic | 6.5 VOLTS MAXIMUM POWER SOURCE |
| NSN | 5962-01-412-6864 |
| PART NAME ASSIGNED BY CONTROLLING AGENCY | PROGRAMMED 32768 X 8 |
| TIME RATING PER CHACTERISTIC | 250.00 NANOSECONDS MAXIMUM ACCESS NS |
| VOLTAGE RATING AND TYPE PER CHARACTERISTIC | 6.5 VOLTS MAXIMUM POWER SOURCE |
| MEMORY DEVICE TYPE | EPROM |
| TERMINAL SURFACE TREATMENT | SOLDER |
| TERMINAL TYPE AND QUANTITY | 28 PRINTED CIRCUIT |
| INCLOSURE MATERIAL | CERAMIC |
| INCLOSURE CONFIGURATION | DUAL-IN-LINE |
| OPERATING TEMP RANGE | -55.0 TO 125.0 CELSIUS DEGC |