The IBM SAS CBL YI SYST TO SAS 3M is a the manufacturer industrial component. Key specifications include material: PLASTIC INSULATION, overall_width: 0.312 INCHES IN, overall_length: 0.781 INCHES IN, basic_shape_style: CRIMP, surface_treatment: TIN OVERALL EXCEPT INSULATION SINGLE LAYER, material_thickness: 0.028 INCHES IN. This product is currently in active production with full OEM support.
This part is cataloged in the Federal Logistics Information System (FLIS) under NSN 5940-00-681-9854, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.
Verify compatibility with your specific system configuration before ordering.
| material | PLASTIC INSULATION |
| overall_width | 0.312 INCHES IN |
| overall_length | 0.781 INCHES IN |
| basic_shape_style | CRIMP |
| surface_treatment | TIN OVERALL EXCEPT INSULATION SINGLE LAYER |
| material_thickness | 0.028 INCHES IN |
| mounting_slot_width | 0.156 INCHES IN |
| mounting_method_style | OPEN SLOT |
| mounting_tongue_width | 0.312 INCHES IN |
| identification_code_color | BLUE |
| mounting_facility_thickness | 0.028 INCHES IN |
| conductor_accommodation_type | STRAIGHT BARREL SINGLE END |
| NSN | 5940-00-681-9854 |
| MOUNTING TONGUE WIDTH | 0.312 INCHES IN |
| OVERALL WIDTH | 0.312 INCHES IN |
| CONDUCTOR ACCOMMODATION TYPE | STRAIGHT BARREL SINGLE END |
| MAXIMUM CONDUCTOR SIZE ACCOMMODATED | 16 AWG |
| MATERIAL THICKNESS | 0.028 INCHES IN |
| MOUNTING SLOT WIDTH | 0.156 INCHES IN |
| MATERIAL | COPPER OVERALL EXCEPT INSULATION |
| MATERIAL | PLASTIC INSULATION |
| BASIC SHAPE STYLE | CRIMP |
| ELECTRICAL INSULATION FEATURE | INSULATING SLEEVE |