A-4B: SEMICONDUCTOR DEVICE,DIODE.
The SEMICONDUCTOR DEVICE,DIODE is a the manufacturer industrial component. Key specifications include material: PLASTIC, inscription: RAMP UP, special_features: HEAVY DUTY ADHESIVE, adhesive_location: BACK, attachment_method: PRESSURE SENSITIVE ADHESIVE, features_provided: HERMETICALLY SEALED CASE. This part is cataloged in the U.S.
Government catalog under NSN 5961-00-557-6121, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.
Verify compatibility with your specific system configuration before ordering.
| material | PLASTIC |
| inscription | RAMP UP |
| special_features | HEAVY DUTY ADHESIVE |
| adhesive_location | BACK |
| attachment_method | PRESSURE SENSITIVE ADHESIVE |
| features_provided | HERMETICALLY SEALED CASE |
| terminal_type_and_quantity | 2 UNINSULATED WIRE LEAD |
| nondefinitive_spec/std_data | NO. 1N468 TYPE |
| NSN | 5961-00-557-6121 |
| FEATURES PROVIDED | HERMETICALLY SEALED CASE |
| NONDEFINITIVE SPEC/STD DATA | NO. 1N468 TYPE |
| MATERIAL | SILICON SEMICONDUCTOR |
| TERMINAL TYPE AND QUANTITY | 2 UNINSULATED WIRE LEAD |