9976-CDKF — MICROCIRCUIT,MEMORY

✓ Government record, cited

— · COMPONENT

PRODUCT OVERVIEW

9976-CDKF: MICROCIRCUIT,MEMORY.

The MICROCIRCUIT,MEMORY is a the manufacturer memory module engineered for enterprise server and workstation platforms requiring validated, high-reliability memory. Key specifications include body_width: 0.500 INCHES MINIMUM AND 0.610 INCHES MAXIMUM IN, body_height: 0.172 INCHES MINIMUM AND 0.217 INCHES MAXIMUM IN, body_length: 1.490 INCHES MAXIMUM IN, bit_quantity: 262144, word_quantity: 32768, overall_height: 0.432 INCHES MAXIMUM IN. This part is cataloged in the U.S.

Government catalog under NSN 5962-01-342-3467, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.

Verify compatibility with your specific system configuration before ordering.

WHERE IT FITS

9976-CDKF

NSN: 5962-01-342-3467
FSC: 5962 — Microcircuits, Electronic
CAGE: 33827 — BAE SYSTEMS INTEGRATED DEFENSE SOLUTIONS INC. (USA)

SPECIFICATIONS

body_width	0.500 INCHES MINIMUM AND 0.610 INCHES MAXIMUM IN
body_height	0.172 INCHES MINIMUM AND 0.217 INCHES MAXIMUM IN
body_length	1.490 INCHES MAXIMUM IN
bit_quantity	262144
word_quantity	32768
overall_height	0.432 INCHES MAXIMUM IN
overall_length	1.490 INCHES MAXIMUM IN
features_provided	HERMETICALLY SEALED AND BURN IN AND PROGRAMMED AND ULTRAVIOLET ERASABLE
output_logic_form	N-TYPE METAL OXIDE-SEMICONDUCTOR LOGIC
inclosure_material	CERAMIC
memory_device_type	EPROM
storage_temp_range	-65.0 TO 150.0 CELSIUS DEGC
NSN	5962-01-342-3467

COMPONENT DIAGRAM

KEY FEATURES

•

BIT QUANTITY: 262144

•

INPUT CIRCUIT PATTERN: 17 INPUT

•

WORD QUANTITY: 32768

•

INCLOSURE MATERIAL: CERAMIC

•

TERMINAL SURFACE TREATMENT: SOLDER

•

BODY WIDTH: 0.500 INCHES MINIMUM AND 0.610 INCHES MAXIMUM IN

•

BODY HEIGHT: 0.172 INCHES MINIMUM AND 0.217 INCHES MAXIMUM IN

TYPICAL APPLICATIONS

Server memory expansion for virtualization workloads
Database performance optimization (in-memory computing)
VDI and remote desktop session hosting
High-performance computing (HPC) clusters
Mail server and collaboration platform scaling
Application server tier expansion

TECHNICAL CHARACTERISTICS

BIT QUANTITY	262144
OVERALL HEIGHT	0.432 INCHES MAXIMUM IN
INPUT CIRCUIT PATTERN	17 INPUT
WORD QUANTITY	32768
INCLOSURE MATERIAL	CERAMIC
TERMINAL SURFACE TREATMENT	SOLDER
BODY WIDTH	0.500 INCHES MINIMUM AND 0.610 INCHES MAXIMUM IN
BODY HEIGHT	0.172 INCHES MINIMUM AND 0.217 INCHES MAXIMUM IN
OVERALL LENGTH	1.490 INCHES MAXIMUM IN
FEATURES PROVIDED	HERMETICALLY SEALED AND BURN IN AND PROGRAMMED AND ULTRAVIOLET ERASABLE

SUBSTITUTES & CROSS-REFERENCES 2

ROM/PROMReference document

Same NSN cross-reference

Reference document — Secondary reference

8411102YAReference document

Same NSN cross-reference

Reference document — Secondary reference

LIFECYCLE

NSN statusActive· U.S. Government catalog

Acquisition advice: Insurance item — stocked against contingency demandDemilitarization required — critical (Q)

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FREQUENTLY ASKED QUESTIONS

What is 9976-CDKF?

9976-CDKF is a MICROCIRCUIT,MEMORY.

What parts can replace 9976-CDKF?

There are 2 known substitutes for 9976-CDKF: ROM/PROM, 8411102YA. Substitute compatibility should be verified for your specific system.

What is the NSN for 9976-CDKF?

9976-CDKF is cataloged in the U.S. Government catalog under NSN 5962-01-342-3467. This indicates validated use in U.S. government and defense supply chains.

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9976-CDKF — MICROCIRCUIT,MEMORY

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