The MICROCIRCUIT,MEMORY is a the manufacturer memory module engineered for enterprise server and workstation platforms requiring validated, high-reliability memory. Key specifications include body_width: 0.290 INCHES NOMINAL IN, body_height: 0.120 INCHES MAXIMUM IN, body_length: 0.970 INCHES MINIMUM AND 1.020 INCHES MAXIMUM IN, features_provided: HERMETICALLY SEALED AND BURN IN AND MONOLITHIC AND W/ENABLE AND ELECTROSTATIC SENSITIVE, output_logic_form: COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC, inclosure_material: CERAMIC. This product is currently in active production with full OEM support.
This part is cataloged in the Federal Logistics Information System (FLIS) under NSN 5962-01-220-9333, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.
Verify compatibility with your specific system configuration before ordering.
| body_width | 0.290 INCHES NOMINAL IN |
| body_height | 0.120 INCHES MAXIMUM IN |
| body_length | 0.970 INCHES MINIMUM AND 1.020 INCHES MAXIMUM IN |
| features_provided | HERMETICALLY SEALED AND BURN IN AND MONOLITHIC AND W/ENABLE AND ELECTROSTATIC SENSITIVE |
| output_logic_form | COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC |
| inclosure_material | CERAMIC |
| memory_device_type | RAM |
| storage_temp_range | -65.0 TO 150.0 CELSIUS DEGC |
| test_data_document | 96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.). |
| operating_temp_range | -55.0 TO 125.0 CELSIUS DEGC |
| input_circuit_pattern | 17 INPUT |
| inclosure_configuration | DUAL-IN-LINE |
| NSN | 5962-01-220-9333 |
| TIME RATING PER CHACTERISTIC | 45.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT AND 45.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, HIGH TO LOW LEVEL OUTPUT NS |
| VOLTAGE RATING AND TYPE PER CHARACTERISTIC | 7.0 VOLTS MAXIMUM POWER SOURCE |
| TERMINAL TYPE AND QUANTITY | 20 PRINTED CIRCUIT |
| TERMINAL SURFACE TREATMENT | SOLDER |
| MEMORY DEVICE TYPE | RAM |
| TEST DATA DOCUMENT | 96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.). |
| BODY HEIGHT | 0.120 INCHES MAXIMUM IN |
| INCLOSURE MATERIAL | CERAMIC |
| BODY WIDTH | 0.290 INCHES NOMINAL IN |
| FEATURES PROVIDED | HERMETICALLY SEALED AND BURN IN AND MONOLITHIC AND W/ENABLE AND ELECTROSTATIC SENSITIVE |