99-00197: SEMICONDUCTOR DEVICE ASSEMBLY.
The SEMICONDUCTOR DEVICE ASSEMBLY is a the manufacturer industrial component. Key specifications include material: ALUMINUM ALLOY 2024 OVERALL, body_style: PLAIN, WITH LIGHTENING HOLES, bore_style: W/COUNTERBORE COUNTER BORE SECOND END, pitch_diameter: 3.1250 INCHES NOMINAL IN, pressure_angle: 20.0000 DEGREES, teeth_quantity: 150. This part is cataloged in the U.S.
Government catalog under NSN 4320-01-118-2118, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.
Verify compatibility with your specific system configuration before ordering.
| material | ALUMINUM ALLOY 2024 OVERALL |
| body_style | PLAIN, WITH LIGHTENING HOLES |
| bore_style | W/COUNTERBORE COUNTER BORE SECOND END |
| pitch_diameter | 3.1250 INCHES NOMINAL IN |
| pressure_angle | 20.0000 DEGREES |
| teeth_quantity | 150 |
| special_features | HUB IS CONE SHAPED;TAPERS 0.062 IN FROM END BACK TO BODY FLARING TO A DIA OF 1.062 IN. IN |
| style_designator | PROTRUDING HUB, RECESSED BODY |
| face_nominal_width | 0.125 INCHES IN |
| hub_nominal_diameter | 0.375 INCHES FIRST END IN |
| hub_style_designator | PLAIN FIRST END |
| bore_nominal_diameter | 0.187 INCHES FIRST END IN |
| NSN | 4320-01-118-2118 |
| END ITEM IDENTIFICATION | GOVERNOR HYD AMP |