The SEMICONDUCTOR DEVICE,DIODE is a the manufacturer industrial component. Key specifications include material: SILICON SEMICONDUCTOR, hole_diameter: 1.615 INCHES NOMINAL IN, outside_diameter: 1.800 INCHES NOMINAL IN, style_designator: SPLIT, features_provided: HERMETICALLY SEALED CASE, material_thickness: 0.010 INCHES NOMINAL IN. This product is currently in active production with full OEM support.
This part is cataloged in the Federal Logistics Information System (FLIS) under NSN 5310-00-598-8308, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.
Verify compatibility with your specific system configuration before ordering.
| material | SILICON SEMICONDUCTOR |
| hole_diameter | 1.615 INCHES NOMINAL IN |
| outside_diameter | 1.800 INCHES NOMINAL IN |
| style_designator | SPLIT |
| features_provided | HERMETICALLY SEALED CASE |
| material_thickness | 0.010 INCHES NOMINAL IN |
| terminal_type_and_quantity | 2 UNINSULATED WIRE LEAD |
| nondefinitive_spec/std_data | 1N751 TYPE |
| distance_across_split_opening | 0.370 INCHES NOMINAL IN |
| material_document_and_classification | MIL-S-5059 MIL SPEC SINGLE MATERIAL RESPONSE OVERALL |
| NSN | 5310-00-598-8308 |
| MATERIAL DOCUMENT AND CLASSIFICATION | MIL-S-5059 MIL SPEC SINGLE MATERIAL RESPONSE OVERALL |
| MATERIAL | STEEL COMP 301 OVERALL |
| STYLE DESIGNATOR | SPLIT |
| MATERIAL THICKNESS | 0.010 INCHES NOMINAL IN |
| DISTANCE ACROSS SPLIT OPENING | 0.370 INCHES NOMINAL IN |
| OUTSIDE DIAMETER | 1.800 INCHES NOMINAL IN |
| HOLE DIAMETER | 1.615 INCHES NOMINAL IN |