The MICROCIRCUIT,DIGITAL is a the manufacturer industrial component. Key specifications include body_width: 0.250 INCHES NOMINAL IN, body_height: 0.180 INCHES MAXIMUM IN, body_length: 0.710 INCHES MINIMUM AND 0.770 INCHES MAXIMUM IN, features_provided: LOW POWER AND HIGH SPEED AND HIGH NOISE, output_logic_form: DIODE-TRANSISTOR LOGIC, inclosure_material: PLASTIC. This part is cataloged in the Federal Logistics Information System (FLIS) under NSN 5962-00-503-8672, indicating validated use in U.S.
government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels. Verify compatibility with your specific system configuration before ordering.
| body_width | 0.250 INCHES NOMINAL IN |
| body_height | 0.180 INCHES MAXIMUM IN |
| body_length | 0.710 INCHES MINIMUM AND 0.770 INCHES MAXIMUM IN |
| features_provided | LOW POWER AND HIGH SPEED AND HIGH NOISE |
| output_logic_form | DIODE-TRANSISTOR LOGIC |
| inclosure_material | PLASTIC |
| storage_temp_range | -65.0 TO 150.0 CELSIUS DEGC |
| operating_temp_range | -0.0 TO 75.0 CELSIUS DEGC |
| input_circuit_pattern | TRIPLE 3 INPUT |
| inclosure_configuration | DUAL-IN-LINE |
| terminal_surface_treatment | SOLDER |
| terminal_type_and_quantity | 14 PRINTED CIRCUIT |
| NSN | 5962-00-503-8672 |
| BODY HEIGHT | 0.140 INCHES MINIMUM AND 0.185 INCHES MAXIMUM IN |
| STORAGE TEMP RANGE | -65.0 TO 150.0 CELSIUS DEGC |
| INCLOSURE MATERIAL | CERAMIC AND GLASS |
| FEATURES PROVIDED | HERMETICALLY SEALED AND MONOLITHIC AND POSITIVE OUTPUTS AND MEDIUM SPEED AND MEDIUM POWER |
| OPERATING TEMP RANGE | -55.0 TO 125.0 CELSIUS DEGC |
| MAXIMUM POWER DISSIPATION RATING | 69.0 MILLIWATTS |
| CASE OUTLINE SOURCE AND DESIGNATOR | D-1 MIL-M-38510 |
| TERMINAL SURFACE TREATMENT | SOLDER |
| TERMINAL TYPE AND QUANTITY | 14 PRINTED CIRCUIT |
| INPUT CIRCUIT PATTERN | TRIPLE 3 INPUT |