The MICROCIRCUIT,DIGITAL is a the manufacturer industrial component. Key specifications include features_provided: BURN IN, output_logic_form: COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC, inclosure_material: CERAMIC, storage_temp_range: -65.0 TO 150.0 CELSIUS DEGC, operating_temp_range: -55.0 TO 125.0 CELSIUS DEGC, inclosure_configuration: DUAL-IN-LINE. This product is currently in active production with full OEM support.
This part is cataloged in the Federal Logistics Information System under NSN 5962-01-363-6622, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.
Verify compatibility with your specific system configuration before ordering.
| features_provided | BURN IN |
| output_logic_form | COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC |
| inclosure_material | CERAMIC |
| storage_temp_range | -65.0 TO 150.0 CELSIUS DEGC |
| operating_temp_range | -55.0 TO 125.0 CELSIUS DEGC |
| inclosure_configuration | DUAL-IN-LINE |
| terminal_surface_treatment | SOLDER |
| design_function_and_quantity | 2 FLIP-FLOP |
| NSN | 5962-01-363-6622 |
| INCLOSURE CONFIGURATION | DUAL-IN-LINE |
| INCLOSURE MATERIAL | CERAMIC |
| OUTPUT LOGIC FORM | COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC |
| STORAGE TEMP RANGE | -65.0 TO 150.0 CELSIUS DEGC |
| TERMINAL TYPE AND QUANTITY | 14 PRINTED CIRCUIT |
| OPERATING TEMP RANGE | -55.0 TO 125.0 CELSIUS DEGC |
| TERMINAL SURFACE TREATMENT | SOLDER |
| FEATURES PROVIDED | BURN IN |
| DESIGN FUNCTION AND QUANTITY | 2 FLIP-FLOP |