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932175-1C — MICROCIRCUIT,MEMORY

✓ Government record, cited
— · COMPONENT
PRODUCT OVERVIEW

932175-1C: MICROCIRCUIT,MEMORY.

The MICROCIRCUIT,MEMORY is a the manufacturer memory module engineered for enterprise server and workstation platforms requiring validated, high-reliability memory. Key specifications include body_width: 0.940 INCHES NOMINAL IN, body_height: 0.115 INCHES MAXIMUM IN, body_length: 2.030 INCHES MINIMUM AND 2.070 INCHES MAXIMUM IN, features_provided: HERMETICALLY SEALED AND MONOLITHIC AND POSITIVE OUTPUTS AND W/DECODED OUTPUT AND W/ENABLE, output_logic_form: P-TYPE METAL OXIDE-SEMICONDUCTOR LOGIC, inclosure_material: GLASS AND METAL. This part is cataloged in the U.S.

Government catalog under NSN 5962-00-469-4753, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.

Verify compatibility with your specific system configuration before ordering.

WHERE IT FITS
932175-1C
NSN: 5962-00-469-4753
FSC: 5962 — Microcircuits, Electronic
CAGE: 82577 — RAYTHEON COMPANY DBA RAYTHEON (USA)
SPECIFICATIONS
body_width0.940 INCHES NOMINAL IN
body_height0.115 INCHES MAXIMUM IN
body_length2.030 INCHES MINIMUM AND 2.070 INCHES MAXIMUM IN
features_providedHERMETICALLY SEALED AND MONOLITHIC AND POSITIVE OUTPUTS AND W/DECODED OUTPUT AND W/ENABLE
output_logic_formP-TYPE METAL OXIDE-SEMICONDUCTOR LOGIC
inclosure_materialGLASS AND METAL
memory_device_typeROM
storage_temp_range-65.0 TO 150.0 CELSIUS DEGC
operating_temp_range-55.0 TO 125.0 CELSIUS DEGC
input_circuit_pattern18 INPUT
inclosure_configurationDUAL-IN-LINE
terminal_surface_treatmentSOLDER
NSN5962-00-469-4753
COMPONENT DIAGRAM
COMPONENT MAIN IC EDGE CONNECTOR No detailed specs available MICROCIRCUIT,MEMORY TITLE COMPONENT PN 932175-1C MFR MICROCIRCUIT,MEMORY
KEY FEATURES
•
INPUT CIRCUIT PATTERN: 18 INPUT
•
INCLOSURE MATERIAL: GLASS AND METAL
•
TERMINAL SURFACE TREATMENT: SOLDER
•
BODY WIDTH: 0.940 INCHES NOMINAL IN
•
BODY HEIGHT: 0.115 INCHES MAXIMUM IN
•
FEATURES PROVIDED: HERMETICALLY SEALED AND MONOLITHIC AND POSITIVE OUTPUTS AND W/DECODED OUTPUT AND W/ENABLE
•
INCLOSURE CONFIGURATION: DUAL-IN-LINE
•
MEMORY DEVICE TYPE: ROM
TYPICAL APPLICATIONS
  • Server memory expansion for virtualization workloads
  • Database performance optimization (in-memory computing)
  • VDI and remote desktop session hosting
  • High-performance computing (HPC) clusters
  • Mail server and collaboration platform scaling
  • Application server tier expansion
TECHNICAL CHARACTERISTICS
INPUT CIRCUIT PATTERN18 INPUT
INCLOSURE MATERIALGLASS AND METAL
TERMINAL SURFACE TREATMENTSOLDER
BODY WIDTH0.940 INCHES NOMINAL IN
BODY HEIGHT0.115 INCHES MAXIMUM IN
FEATURES PROVIDEDHERMETICALLY SEALED AND MONOLITHIC AND POSITIVE OUTPUTS AND W/DECODED OUTPUT AND W/ENABLE
INCLOSURE CONFIGURATIONDUAL-IN-LINE
MEMORY DEVICE TYPEROM
BODY LENGTH2.030 INCHES MINIMUM AND 2.070 INCHES MAXIMUM IN
STORAGE TEMP RANGE-65.0 TO 150.0 CELSIUS DEGC
SUBSTITUTES & CROSS-REFERENCES 5
ROM/PROMReference document
Same NSN cross-reference
Reference document — Secondary reference
SUN029BSame NSN cross-reference
Same NSN cross-reference
Also cataloged under this NSN
C9321Reference document
Same NSN cross-reference
Reference document — Secondary reference
C8381Reference document
Same NSN cross-reference
Reference document — Secondary reference
932291-1CReference document
Same NSN cross-reference
Reference document — Secondary reference
LIFECYCLE
NSN statusActive· U.S. Government catalog
Acquisition advice: Terminal item — stock exhausted; no further procurementDemilitarization required — critical (Q)
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FREQUENTLY ASKED QUESTIONS
What is 932175-1C?
932175-1C is a MICROCIRCUIT,MEMORY.
What parts can replace 932175-1C?
There are 5 known substitutes for 932175-1C: ROM/PROM, SUN029B, C9321 and 2 more. Substitute compatibility should be verified for your specific system.
What is the NSN for 932175-1C?
932175-1C is cataloged in the U.S. Government catalog under NSN 5962-00-469-4753. This indicates validated use in U.S. government and defense supply chains.
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