9309FMQB: MICROCIRCUIT,DIGITAL.
The MICROCIRCUIT,DIGITAL is a the manufacturer industrial component. Key specifications include body_width: 0.245 INCHES MINIMUM AND 0.285 INCHES MAXIMUM IN, body_height: 0.045 INCHES MINIMUM AND 0.085 INCHES MAXIMUM IN, body_length: 0.440 INCHES MAXIMUM IN, features_provided: HERMETICALLY SEALED AND BURN IN AND MONOLITHIC AND POSITIVE OUTPUTS, output_logic_form: TRANSISTOR-TRANSISTOR LOGIC, inclosure_material: CERAMIC. This part is cataloged in the U.S.
Government catalog under NSN 5962-01-021-8058, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.
Verify compatibility with your specific system configuration before ordering.
| body_width | 0.245 INCHES MINIMUM AND 0.285 INCHES MAXIMUM IN |
| body_height | 0.045 INCHES MINIMUM AND 0.085 INCHES MAXIMUM IN |
| body_length | 0.440 INCHES MAXIMUM IN |
| features_provided | HERMETICALLY SEALED AND BURN IN AND MONOLITHIC AND POSITIVE OUTPUTS |
| output_logic_form | TRANSISTOR-TRANSISTOR LOGIC |
| inclosure_material | CERAMIC |
| storage_temp_range | -65.0 TO 150.0 CELSIUS DEGC |
| operating_temp_range | -55.0 TO 125.0 CELSIUS DEGC |
| input_circuit_pattern | 10 INPUT |
| inclosure_configuration | FLAT PACK |
| terminal_surface_treatment | SOLDER |
| terminal_type_and_quantity | 16 FLAT LEADS |
| NSN | 5962-01-021-8058 |
| INPUT CIRCUIT PATTERN | DUAL 4 INPUT |
| INCLOSURE MATERIAL | CERAMIC AND GLASS |
| TERMINAL SURFACE TREATMENT | SOLDER |
| DESIGN FUNCTION AND QUANTITY | 2 MULTIPLEXER |
| BODY WIDTH | 0.247 INCHES MINIMUM AND 0.283 INCHES MAXIMUM IN |
| BODY HEIGHT | 0.050 INCHES MINIMUM AND 0.075 INCHES MAXIMUM IN |
| FEATURES PROVIDED | MONOLITHIC AND HERMETICALLY SEALED AND HIGH SPEED AND COMPLEMENTARY OUTPUTS AND POSITIVE OUTPUTS |
| INCLOSURE CONFIGURATION | FLAT PACK |
| BODY LENGTH | 0.371 INCHES MINIMUM AND 0.409 INCHES MAXIMUM IN |
| STORAGE TEMP RANGE | -65.0 TO 150.0 CELSIUS DEGC |