The SEMICONDUCTOR DEVICE,DIODE is a the manufacturer industrial component. Key specifications include material: SILICON SEMICONDUCTOR, overall_length: 0.300 INCHES MAXIMUM IN, mounting_method: TERMINAL, terminal_length: 1.250 INCHES MINIMUM IN, overall_diameter: 0.105 INCHES MAXIMUM IN, features_provided: HERMETICALLY SEALED CASE. This product is currently in active production with full OEM support.
This part is cataloged in the Federal Logistics Information System (FLIS) under NSN 5961-01-172-5776, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.
Verify compatibility with your specific system configuration before ordering.
| material | SILICON SEMICONDUCTOR |
| overall_length | 0.300 INCHES MAXIMUM IN |
| mounting_method | TERMINAL |
| terminal_length | 1.250 INCHES MINIMUM IN |
| overall_diameter | 0.105 INCHES MAXIMUM IN |
| features_provided | HERMETICALLY SEALED CASE |
| terminal_type_and_quantity | 2 UNINSULATED WIRE LEAD |
| current_rating_per_characteristic | 5.00 AMPERES MAXIMUM REVERSE CURRENT, DC |
| voltage_rating_in_volts_per_characteristic | 150.0 MAXIMUM BREAKDOWN VOLTAGE, DC AND 130.0 MAXIMUM REVERSE VOLTAGE, PEAK |
| maximum_operating_temp_per_measurement_point | 60.0 CELSIUS AMBIENT AIR DEGC |
| NSN | 5961-01-172-5776 |
| MATERIAL | GLASS ENCLOSURE |
| MATERIAL | SILICON SEMICONDUCTOR |
| TERMINAL TYPE AND QUANTITY | 2 UNINSULATED WIRE LEAD |
| MOUNTING METHOD | TERMINAL |
| TERMINAL LENGTH | 1.250 INCHES MINIMUM IN |
| MAXIMUM OPERATING TEMP PER MEASUREMENT POINT | 60.0 CELSIUS AMBIENT AIR DEGC |
| OVERALL LENGTH | 0.300 INCHES MAXIMUM IN |
| VOLTAGE RATING IN VOLTS PER CHARACTERISTIC | 150.0 MAXIMUM BREAKDOWN VOLTAGE, DC AND 130.0 MAXIMUM REVERSE VOLTAGE, PEAK |
| FEATURES PROVIDED | HERMETICALLY SEALED CASE |
| OVERALL DIAMETER | 0.105 INCHES MAXIMUM IN |