The SEMICONDUCTOR DEVICE,DIODE is a the manufacturer industrial component. Key specifications include material: SILICON SEMICONDUCTOR, overall_length: 0.300 INCHES MAXIMUM IN, mounting_method: TERMINAL, terminal_length: 1.000 INCHES MINIMUM IN, overall_diameter: 0.125 INCHES MINIMUM AND 0.150 INCHES MAXIMUM IN, features_provided: HERMETICALLY SEALED CASE. This part is cataloged in the Federal Logistics Information System under NSN 5961-00-843-7596, indicating validated use in U.S.
government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels. Verify compatibility with your specific system configuration before ordering.
| material | SILICON SEMICONDUCTOR |
| overall_length | 0.300 INCHES MAXIMUM IN |
| mounting_method | TERMINAL |
| terminal_length | 1.000 INCHES MINIMUM IN |
| overall_diameter | 0.125 INCHES MINIMUM AND 0.150 INCHES MAXIMUM IN |
| features_provided | HERMETICALLY SEALED CASE |
| terminal_type_and_quantity | 1 TAB, SOLDER LUG |
| current_rating_per_characteristic | 20.00 AMPERES MAXIMUM AVERAGE FORWARD CURRENT AVERAGED OVER A FULL 60-HZ CYCLE |
| voltage_rating_in_volts_per_characteristic | 220.0 MAXIMUM REVERSE VOLTAGE, PEAK |
| maximum_operating_temp_per_measurement_point | 175.0 CELSIUS CASE DEGC |
| NSN | 5961-00-843-7596 |
| MATERIAL | SILICON SEMICONDUCTOR |
| TERMINAL TYPE AND QUANTITY | 1 TAB, SOLDER LUG |
| OVERALL DIAMETER | 0.125 INCHES MINIMUM AND 0.150 INCHES MAXIMUM IN |
| MOUNTING METHOD | TERMINAL |
| CURRENT RATING PER CHARACTERISTIC | 20.00 AMPERES MAXIMUM AVERAGE FORWARD CURRENT AVERAGED OVER A FULL 60-HZ CYCLE |
| TERMINAL LENGTH | 1.000 INCHES MINIMUM IN |
| MAXIMUM OPERATING TEMP PER MEASUREMENT POINT | 175.0 CELSIUS CASE DEGC |
| OVERALL LENGTH | 0.300 INCHES MAXIMUM IN |
| FEATURES PROVIDED | HERMETICALLY SEALED CASE |
| VOLTAGE RATING IN VOLTS PER CHARACTERISTIC | 220.0 MAXIMUM REVERSE VOLTAGE, PEAK |