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911731-241 — MICROCIRCUIT,MEMORY

✓ Government record, cited
— · COMPONENT
PRODUCT OVERVIEW

911731-241: MICROCIRCUIT,MEMORY.

The MICROCIRCUIT,MEMORY is a the manufacturer memory module engineered for enterprise server and workstation platforms requiring validated, high-reliability memory. Key specifications include body_height: 0.310 INCHES MAXIMUM IN, body_length: 0.840 INCHES MAXIMUM IN, features_provided: MONOLITHIC AND BIPOLAR AND PROGRAMMABLE, output_logic_form: TRANSISTOR-TRANSISTOR LOGIC, memory_device_type: PROM, storage_temp_range: -65.0 TO 150.0 CELSIUS DEGC. This part is cataloged in the U.S.

Government catalog under NSN 5962-01-231-4699, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.

Verify compatibility with your specific system configuration before ordering.

WHERE IT FITS
911731-241
NSN: 5962-01-231-4699
FSC: 5962 — Microcircuits, Electronic
CAGE: 3B150 — RAYTHEON COMPANY DBA RAYTHEON CO (USA)
SPECIFICATIONS
body_height0.310 INCHES MAXIMUM IN
body_length0.840 INCHES MAXIMUM IN
features_providedMONOLITHIC AND BIPOLAR AND PROGRAMMABLE
output_logic_formTRANSISTOR-TRANSISTOR LOGIC
memory_device_typePROM
storage_temp_range-65.0 TO 150.0 CELSIUS DEGC
test_data_document96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.).
operating_temp_range-55.0 TO 125.0 CELSIUS DEGC
input_circuit_pattern10 INPUT
inclosure_configurationDUAL-IN-LINE
terminal_surface_treatmentSOLDER
maximum_power_dissipation_rating794.0 MILLIWATTS
NSN5962-01-231-4699
COMPONENT DIAGRAM
COMPONENT MAIN IC EDGE CONNECTOR No detailed specs available MICROCIRCUIT,MEMORY TITLE COMPONENT PN 911731-241 MFR MICROCIRCUIT,MEMORY
KEY FEATURES
•
INPUT CIRCUIT PATTERN: 10 INPUT
•
TERMINAL SURFACE TREATMENT: SOLDER
•
BODY HEIGHT: 0.310 INCHES MAXIMUM IN
•
FEATURES PROVIDED: MONOLITHIC AND BIPOLAR AND PROGRAMMABLE
•
INCLOSURE CONFIGURATION: DUAL-IN-LINE
•
MEMORY DEVICE TYPE: PROM
•
CASE OUTLINE SOURCE AND DESIGNATOR: D-2 MIL-M-38510
•
BODY LENGTH: 0.840 INCHES MAXIMUM IN
TYPICAL APPLICATIONS
  • Server memory expansion for virtualization workloads
  • Database performance optimization (in-memory computing)
  • VDI and remote desktop session hosting
  • High-performance computing (HPC) clusters
  • Mail server and collaboration platform scaling
  • Application server tier expansion
TECHNICAL CHARACTERISTICS
INPUT CIRCUIT PATTERN10 INPUT
TERMINAL SURFACE TREATMENTSOLDER
BODY HEIGHT0.310 INCHES MAXIMUM IN
FEATURES PROVIDEDMONOLITHIC AND BIPOLAR AND PROGRAMMABLE
INCLOSURE CONFIGURATIONDUAL-IN-LINE
MEMORY DEVICE TYPEPROM
CASE OUTLINE SOURCE AND DESIGNATORD-2 MIL-M-38510
BODY LENGTH0.840 INCHES MAXIMUM IN
STORAGE TEMP RANGE-65.0 TO 150.0 CELSIUS DEGC
OUTPUT LOGIC FORMTRANSISTOR-TRANSISTOR LOGIC
OTHER ITEMS IN FSC 5962 — Microcircuits, Electronic
Items in the same Federal Supply class. No interchangeability or substitution relationship is implied.
5962-00-001-1861 5962-00-001-1901 5962-00-001-1902 5962-00-001-1905 5962-00-001-1906 5962-00-001-1907 5962-00-001-1908 5962-00-001-1909
SUBSTITUTES & CROSS-REFERENCES 3
PP954082-3Reference document
Same NSN cross-reference
Reference document — Secondary reference
ROM/PROMReference document
Same NSN cross-reference
Reference document — Secondary reference
M38510/20401BEAReference document
Same NSN cross-reference
Reference document — Secondary reference
LIFECYCLE
NSN statusActive· U.S. Government catalog
Acquisition advice: Insurance item — stocked against contingency demandDemilitarization required — critical (Q)
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FREQUENTLY ASKED QUESTIONS
What is 911731-241?
911731-241 is a MICROCIRCUIT,MEMORY.
What parts can replace 911731-241?
There are 3 known substitutes for 911731-241: PP954082-3, ROM/PROM, M38510/20401BEA. Substitute compatibility should be verified for your specific system.
What is the NSN for 911731-241?
911731-241 is cataloged in the U.S. Government catalog under NSN 5962-01-231-4699. This indicates validated use in U.S. government and defense supply chains.
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