90312-3: MICROCIRCUIT,MEMORY.
The MICROCIRCUIT,MEMORY is a the manufacturer memory module engineered for enterprise server and workstation platforms requiring validated, high-reliability memory. Key specifications include body_width: 0.310 INCHES MAXIMUM IN, body_height: 0.200 INCHES MAXIMUM IN, body_length: 1.060 INCHES MAXIMUM IN, mounting_method: UNTHREADED HOLE(S), special_features: ALTERED ITEM PROGRAMMED USING 67268/5962-8851501RX USING VERSION OR FIRMWARE DESCRIPTION DOCUMENT VDD0236.02..01, style_designator: PARABOLIC DISH SPHERICAL. This part is cataloged in the U.S.
Government catalog under NSN 5985-01-384-9768, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.
Verify compatibility with your specific system configuration before ordering.
| body_width | 0.310 INCHES MAXIMUM IN |
| body_height | 0.200 INCHES MAXIMUM IN |
| body_length | 1.060 INCHES MAXIMUM IN |
| mounting_method | UNTHREADED HOLE(S) |
| special_features | ALTERED ITEM PROGRAMMED USING 67268/5962-8851501RX USING VERSION OR FIRMWARE DESCRIPTION DOCUMENT VDD0236.02..01 |
| style_designator | PARABOLIC DISH SPHERICAL |
| features_provided | ELECTROSTATIC SENSITIVE AND TESTED TO MIL-STD-883 AND PROGRAMMED AND BURN IN, MIL-STD-883, CLASS B AND ERASABLE |
| output_logic_form | BIPOLAR METAL-OXIDE SEMICONDUCTOR |
| surface_treatment | CHROMATE AND CHROMATE ZINC AND ENAMEL SEMIGLOSS |
| inclosure_material | SILICON |
| memory_device_type | PAL |
| mounting_hole_type | PLAIN |
| NSN | 5985-01-384-9768 |
| MOUNTING FACILITY QUANTITY | 2 |
| MOUNTING METHOD | UNTHREADED HOLE(S) |
| STYLE DESIGNATOR | PARABOLIC DISH SPHERICAL |
| MOUNTING HOLE DIAMETER | 0.250 INCHES NOMINAL IN |
| SURFACE TREATMENT | CHROMATE AND CHROMATE ZINC AND ENAMEL SEMIGLOSS |
| MOUNTING HOLE TYPE | PLAIN |