90305-9: MICROCIRCUIT,MEMORY.
The MICROCIRCUIT,MEMORY is a the manufacturer memory module engineered for enterprise server and workstation platforms requiring validated, high-reliability memory. Key specifications include material: RUBBER SILICONE CLASS Q, body_width: 0.220 INCHES MINIMUM AND 0.310 INCHES MAXIMUM IN, body_height: 0.140 INCHES MINIMUM AND 0.185 INCHES MAXIMUM IN, body_length: 1.060 INCHES MAXIMUM IN, hardness_rating: 70.0 SHORE DUROMETER A NOMINAL, outside_diameter: 0.555 INCHES MINIMUM AND 0.577 INCHES MAXIMUM IN. This part is cataloged in the U.S.
Government catalog under NSN 5331-00-724-7902, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.
Verify compatibility with your specific system configuration before ordering.
| material | RUBBER SILICONE CLASS Q |
| body_width | 0.220 INCHES MINIMUM AND 0.310 INCHES MAXIMUM IN |
| body_height | 0.140 INCHES MINIMUM AND 0.185 INCHES MAXIMUM IN |
| body_length | 1.060 INCHES MAXIMUM IN |
| hardness_rating | 70.0 SHORE DUROMETER A NOMINAL |
| outside_diameter | 0.555 INCHES MINIMUM AND 0.577 INCHES MAXIMUM IN |
| special_features | ALTERED ITEM PROGRAMMABLE TO DRWG. 90305-9 MAKE FROM 5962-8851503RA |
| features_provided | HERMETICALLY SEALED AND BURN IN AND PROGRAMMABLE AND BIPOLAR AND MONOLITHIC AND ELECTROSTATIC SENSITIVE |
| output_logic_form | TRANSISTOR-TRANSISTOR LOGIC |
| inclosure_material | CERAMIC |
| memory_device_type | PAL |
| storage_temp_range | -65.0 TO 150.0 CELSIUS DEGC |
| NSN | 5331-00-724-7902 |
| CROSS-SECTIONAL HEIGHT | 0.067 INCHES MINIMUM AND 0.073 INCHES MAXIMUM IN |
| OUTSIDE DIAMETER | 0.555 INCHES MINIMUM AND 0.577 INCHES MAXIMUM IN |
| HARDNESS RATING | 70.0 SHORE DUROMETER A NOMINAL |
| ELONGATION PERCENTAGE | 125 MAXIMUM |
| CENTER HOLE DIAMETER | 0.421 INCHES MINIMUM AND 0.431 INCHES MAXIMUM IN |
| MATERIAL | RUBBER SILICONE CLASS Q |