The SEMICONDUCTOR DEVICE ASSEMBLY is a the manufacturer industrial component. Key specifications include major_components: DIODE 4; HEATSINK 1. This part is cataloged in the U.S.
Government catalog under NSN 5961-01-043-7040, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.
Verify compatibility with your specific system configuration before ordering.
WHERE IT FITS
885D052024
NSN:5961-01-043-7040 FSC:5961 — Semiconductor Devices and Associated Hardware CAGE:03956 — NORTHROP GRUMMAN SYSTEMS CORPORATION (USA)
SPECIFICATIONS
major_components
DIODE 4; HEATSINK 1
NSN
5961-01-043-7040
COMPONENT DIAGRAM
KEY FEATURES
•
MAJOR COMPONENTS: DIODE 4; HEATSINK 1
TECHNICAL CHARACTERISTICS
MAJOR COMPONENTS
DIODE 4; HEATSINK 1
OTHER ITEMS IN FSC 5961 — Semiconductor Devices and Associated Hardware
Items in the same Federal Supply class. No interchangeability or substitution relationship is implied.
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FREQUENTLY ASKED QUESTIONS
What is 885D052024?
885D052024 is a SEMICONDUCTOR DEVICE ASSEMBLY.
What is the NSN for 885D052024?
885D052024 is cataloged in the U.S. Government catalog under NSN 5961-01-043-7040. This indicates validated use in U.S. government and defense supply chains.
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