883-GR0008 — MICROCIRCUIT,MEMORY

✓ Government record, cited

— · COMPONENT

PRODUCT OVERVIEW

883-GR0008: MICROCIRCUIT,MEMORY.

The MICROCIRCUIT,MEMORY is a the manufacturer memory module engineered for enterprise server and workstation platforms requiring validated, high-reliability memory. Key specifications include body_width: 0.440 INCHES MINIMUM AND 0.544 INCHES MAXIMUM IN, body_height: 0.160 INCHES MAXIMUM IN, body_length: 1.176 INCHES MINIMUM AND 1.308 INCHES MAXIMUM IN, bit_quantity: 2048, word_quantity: 256, features_provided: HERMETICALLY SEALED AND MONOLITHIC AND POSITIVE OUTPUTS AND PROGRAMMABLE. This part is cataloged in the U.S.

Government catalog under NSN 5962-01-015-7280, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.

Verify compatibility with your specific system configuration before ordering.

WHERE IT FITS

883-GR0008

NSN: 5962-01-015-7280
NIINs: 010157280, 011527954, 011527955, 011527956, 011527957, 011527959, 011527960, 011527961, 011527963, 011527964, 011527965, 011527966, 011527967, 011527968, 011527969, 011527971, 011527972
FSC: 5962 — Microcircuits, Electronic
CAGE: 86360 — GE AVIATION SYSTEMS LLC DBA GE AVIATION DIV INFORMATION SYSTEMS - GERMANTOWN (USA)

SPECIFICATIONS

body_width	0.440 INCHES MINIMUM AND 0.544 INCHES MAXIMUM IN
body_height	0.160 INCHES MAXIMUM IN
body_length	1.176 INCHES MINIMUM AND 1.308 INCHES MAXIMUM IN
bit_quantity	2048
word_quantity	256
features_provided	HERMETICALLY SEALED AND MONOLITHIC AND POSITIVE OUTPUTS AND PROGRAMMABLE
output_logic_form	TRANSISTOR-TRANSISTOR LOGIC
inclosure_material	CERAMIC AND GLASS
memory_device_type	ROM
storage_temp_range	-65.0 TO 125.0 CELSIUS DEGC
test_data_document	96906-MIL-STD-883B STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.).
operating_temp_range	-40.0 TO 70.0 CELSIUS DEGC
NSN	5962-01-015-7280

COMPONENT DIAGRAM

KEY FEATURES

•

INCLOSURE MATERIAL: CERAMIC

•

TERMINAL SURFACE TREATMENT: SOLDER

•

BODY WIDTH: 0.550 INCHES NOMINAL IN

•

BODY HEIGHT: 0.120 INCHES NOMINAL IN

•

FEATURES PROVIDED: PROGRAMMED

•

INCLOSURE CONFIGURATION: DUAL-IN-LINE

•

MEMORY DEVICE TYPE: PROM

•

BODY LENGTH: 1.300 INCHES NOMINAL IN

TYPICAL APPLICATIONS

Server memory expansion for virtualization workloads
Database performance optimization (in-memory computing)
VDI and remote desktop session hosting
High-performance computing (HPC) clusters
Mail server and collaboration platform scaling
Application server tier expansion

TECHNICAL CHARACTERISTICS

INCLOSURE MATERIAL	CERAMIC
TERMINAL SURFACE TREATMENT	SOLDER
BODY WIDTH	0.550 INCHES NOMINAL IN
BODY HEIGHT	0.120 INCHES NOMINAL IN
FEATURES PROVIDED	PROGRAMMED
INCLOSURE CONFIGURATION	DUAL-IN-LINE
MEMORY DEVICE TYPE	PROM
BODY LENGTH	1.300 INCHES NOMINAL IN
STORAGE TEMP RANGE	-65.0 TO 150.0 CELSIUS DEGC
VOLTAGE RATING AND TYPE PER CHARACTERISTIC	0.5 VOLTS MAXIMUM POWER SOURCE

SUBSTITUTES & CROSS-REFERENCES 1

ROM/PROM FAMILY 034Reference document

Same NSN cross-reference

Reference document — Secondary reference

LIFECYCLE

NSN statusActive· U.S. Government catalog

Acquisition advice: Insurance item — stocked against contingency demandDemilitarization required — mutilation + specific procedure

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FREQUENTLY ASKED QUESTIONS

What is 883-GR0008?

883-GR0008 is a MICROCIRCUIT,MEMORY.

What parts can replace 883-GR0008?

There is 1 known substitute for 883-GR0008: ROM/PROM FAMILY 034. Substitute compatibility should be verified for your specific system.

What is the NSN for 883-GR0008?

883-GR0008 is cataloged in the U.S. Government catalog under NSN 5962-01-015-7280. This indicates validated use in U.S. government and defense supply chains.

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883-GR0008 — MICROCIRCUIT,MEMORY

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