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8770W — COMPUTER SYSTEM,DIGITAL

✓ Government record, cited
— · PROCESSOR · INTEL_XEON
PRODUCT OVERVIEW

8770W: COMPUTER SYSTEM,DIGITAL.

The COMPUTER SYSTEM,DIGITAL is a the manufacturer industrial component. Key specifications include unit_design: LAPTOP, interface_type: USB, special_features: MAXIMUM ITEM CAPABILITIES LISTED FOR MEMORY CAPACITY, HARD DRIVE CAPACITY AND PROCESSOR SPEED, processor_chip_type: INTEL CORE I5/I7, data_storage_capacity: 750.0 GIGABYTES, wireless_connectivity: WIFI. This part is cataloged in the U.S.

Government catalog under NSN 7010-01-649-9667, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.

Verify compatibility with your specific system configuration before ordering.

WHERE IT FITS
PROCESSOR→ INTEL_XEON→ 8770W
NSN: 7010-01-649-9667
FSC: 7010 — Information Technology Equipment System Configuration
CAGE: 28480 — HEWLETT-PACKARD COMPANY DBA HP (USA)
SPECIFICATIONS
unit_designLAPTOP
interface_typeUSB
special_featuresMAXIMUM ITEM CAPABILITIES LISTED FOR MEMORY CAPACITY, HARD DRIVE CAPACITY AND PROCESSOR SPEED
processor_chip_typeINTEL CORE I5/I7
data_storage_capacity750.0 GIGABYTES
wireless_connectivityWIFI
processor_core_quantity4
random_access_memory_size32.0 GIGABYTES
diagonal_display_size_in_inches17.3
recording_medium_for_which_designedHARD DISK
component_type_and_quantity_accommodated1 FAST ETHERNET AND 1 INTERNAL HARD DRIVE AND 1 KEYBOARD AND 1 TOUCHPAD
part_name_assigned_by_controlling_agencyHP ELITEBOOK MOBILE WORKSTATION
NSN7010-01-649-9667
COMPONENT DIAGRAM
PIN 1 SERVER CPU PROCESSOR LGA/SP SOCKET 76.0 mm 56.5 mm LGA/SP SOCKET — Server CPU Pin 1 alignment triangle IHS — Nickel-plated copper Thermal interface to heatsink TDP — 35W to 400W Bronze / Silver / Gold / Platinum CONTACT — LGA pads Socket-side pins (not on CPU) TITLE SERVER CPU PN 8770W MFR COMPUTER SYSTEM,DIGITAL
KEY FEATURES
•
INTERFACE TYPE: USB
•
RECORDING MEDIUM FOR WHICH DESIGNED: HARD DISK
•
RANDOM ACCESS MEMORY SIZE: 32.0 GIGABYTES
•
COMPONENT TYPE AND QUANTITY ACCOMMODATED: 1 FAST ETHERNET AND 1 INTERNAL HARD DRIVE AND 1 KEYBOARD AND 1 TOUCHPAD
•
DIAGONAL DISPLAY SIZE IN INCHES: 17.3
•
PROCESSOR CORE QUANTITY: 4
TECHNICAL CHARACTERISTICS
INTERFACE TYPEUSB
RECORDING MEDIUM FOR WHICH DESIGNEDHARD DISK
RANDOM ACCESS MEMORY SIZE32.0 GIGABYTES
COMPONENT TYPE AND QUANTITY ACCOMMODATED1 FAST ETHERNET AND 1 INTERNAL HARD DRIVE AND 1 KEYBOARD AND 1 TOUCHPAD
DIAGONAL DISPLAY SIZE IN INCHES17.3
PROCESSOR CORE QUANTITY4
SPECIAL FEATURESMAXIMUM ITEM CAPABILITIES LISTED FOR MEMORY CAPACITY, HARD DRIVE CAPACITY AND PROCESSOR SPEED
PART NAME ASSIGNED BY CONTROLLING AGENCYHP ELITEBOOK MOBILE WORKSTATION
PROCESSOR CHIP TYPEINTEL CORE I5/I7
WIRELESS CONNECTIVITYWIFI
OTHER ITEMS IN FSC 7010 — Information Technology Equipment System Configuration
Items in the same Federal Supply class. No interchangeability or substitution relationship is implied.
7010-00-000-0191 7010-00-001-3636 7010-00-005-2317 7010-00-005-8477 7010-00-006-1812 7010-00-011-2756 7010-00-027-6263 7010-00-027-6264
SUBSTITUTES & CROSS-REFERENCES

No substitute or cross-reference records for this part.

LIFECYCLE
NSN statusActive· U.S. Government catalog
No demilitarization required
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FREQUENTLY ASKED QUESTIONS
What is 8770W?
8770W is a COMPUTER SYSTEM,DIGITAL. It is classified as a PROCESSOR (INTEL_XEON).
What is the NSN for 8770W?
8770W is cataloged in the U.S. Government catalog under NSN 7010-01-649-9667. This indicates validated use in U.S. government and defense supply chains.
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