8756272-503 — MICROCIRCUIT,DIGITAL

✓ Government record, cited

— · COMPONENT

PRODUCT OVERVIEW

8756272-503: MICROCIRCUIT,DIGITAL.

The MICROCIRCUIT,DIGITAL is a the manufacturer industrial component. Key specifications include body_width: 0.475 INCHES MINIMUM AND 0.492 INCHES MAXIMUM IN, body_height: 0.100 INCHES MAXIMUM IN, body_length: 0.475 INCHES MINIMUM AND 0.492 INCHES MAXIMUM IN, features_provided: HERMETICALLY SEALED AND BURN IN AND MONOLITHIC AND POSITIVE OUTPUTS, output_logic_form: TRANSISTOR-TRANSISTOR LOGIC, inclosure_material: CERAMIC. This part is cataloged in the U.S.

Government catalog under NSN 5962-01-326-9902, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.

Verify compatibility with your specific system configuration before ordering.

WHERE IT FITS

8756272-503

NSN: 5962-01-326-9902
FSC: 5962 — Microcircuits, Electronic
CAGE: 49671 — LOCKHEED MARTIN CORPORATION DBA LOCKHEED MARTIN DIV LOCKHEED MARTIN (USA)

SPECIFICATIONS

body_width	0.475 INCHES MINIMUM AND 0.492 INCHES MAXIMUM IN
body_height	0.100 INCHES MAXIMUM IN
body_length	0.475 INCHES MINIMUM AND 0.492 INCHES MAXIMUM IN
features_provided	HERMETICALLY SEALED AND BURN IN AND MONOLITHIC AND POSITIVE OUTPUTS
output_logic_form	TRANSISTOR-TRANSISTOR LOGIC
inclosure_material	CERAMIC
storage_temp_range	-65.0 TO 150.0 CELSIUS DEGC
test_data_document	96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.).
operating_temp_range	+0.0 TO 125.0 CELSIUS DEGC
input_circuit_pattern	1 INPUT
inclosure_configuration	LEADLESS FLAT PACK
terminal_surface_treatment	SOLDER
NSN	5962-01-326-9902

COMPONENT DIAGRAM

KEY FEATURES

•

INPUT CIRCUIT PATTERN: 1 INPUT

•

INCLOSURE MATERIAL: CERAMIC

•

TERMINAL SURFACE TREATMENT: SOLDER

•

DESIGN FUNCTION AND QUANTITY: 1 DRIVER

•

BODY WIDTH: 0.475 INCHES MINIMUM AND 0.492 INCHES MAXIMUM IN

•

BODY HEIGHT: 0.100 INCHES MAXIMUM IN

•

FEATURES PROVIDED: HERMETICALLY SEALED AND BURN IN AND MONOLITHIC AND POSITIVE OUTPUTS

•

INCLOSURE CONFIGURATION: LEADLESS FLAT PACK

TECHNICAL CHARACTERISTICS

INPUT CIRCUIT PATTERN	1 INPUT
INCLOSURE MATERIAL	CERAMIC
TERMINAL SURFACE TREATMENT	SOLDER
DESIGN FUNCTION AND QUANTITY	1 DRIVER
BODY WIDTH	0.475 INCHES MINIMUM AND 0.492 INCHES MAXIMUM IN
BODY HEIGHT	0.100 INCHES MAXIMUM IN
FEATURES PROVIDED	HERMETICALLY SEALED AND BURN IN AND MONOLITHIC AND POSITIVE OUTPUTS
INCLOSURE CONFIGURATION	LEADLESS FLAT PACK
BODY LENGTH	0.475 INCHES MINIMUM AND 0.492 INCHES MAXIMUM IN
STORAGE TEMP RANGE	-65.0 TO 150.0 CELSIUS DEGC

SUBSTITUTES & CROSS-REFERENCES 2

72108Reference document

Same NSN cross-reference

Reference document — Secondary reference

5617802-1Same NSN cross-reference

Same NSN cross-reference

Also cataloged under this NSN

LIFECYCLE

NSN statusActive· U.S. Government catalog

Acquisition advice: Terminal item — stock exhausted; no further procurementDemilitarization required — critical (Q)

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FREQUENTLY ASKED QUESTIONS

What is 8756272-503?

8756272-503 is a MICROCIRCUIT,DIGITAL.

What parts can replace 8756272-503?

There are 2 known substitutes for 8756272-503: 72108, 5617802-1. Substitute compatibility should be verified for your specific system.

What is the NSN for 8756272-503?

8756272-503 is cataloged in the U.S. Government catalog under NSN 5962-01-326-9902. This indicates validated use in U.S. government and defense supply chains.

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8756272-503 — MICROCIRCUIT,DIGITAL

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