PartsTable
Technical Data Sheet
Download PDF

8751-012 — MICROCIRCUIT,MEMORY

✓ Government record, cited
— · COMPONENT
PRODUCT OVERVIEW

8751-012: MICROCIRCUIT,MEMORY.

The MICROCIRCUIT,MEMORY is a the manufacturer memory module engineered for enterprise server and workstation platforms requiring validated, high-reliability memory. Key specifications include body_width: 0.480 INCHES MINIMUM AND 0.520 INCHES MAXIMUM IN, body_height: 0.070 INCHES MINIMUM AND 0.130 INCHES MAXIMUM IN, body_length: 1.150 INCHES MINIMUM AND 1.220 INCHES MAXIMUM IN, memory_capacity: UNKNOWN, features_provided: HERMETICALLY SEALED AND 3-STATE OUTPUT AND HIGH IMPEDANCE, output_logic_form: COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC. This part is cataloged in the U.S.

Government catalog under NSN 5962-01-128-3903, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.

Verify compatibility with your specific system configuration before ordering.

WHERE IT FITS
8751-012
NSN: 5962-01-128-3903
FSC: 5962 — Microcircuits, Electronic
CAGE: 55009 — STELLAR MICROELECTRONICS, INC. DIV NEOTECH STELLAR (USA)
SPECIFICATIONS
body_width0.480 INCHES MINIMUM AND 0.520 INCHES MAXIMUM IN
body_height0.070 INCHES MINIMUM AND 0.130 INCHES MAXIMUM IN
body_length1.150 INCHES MINIMUM AND 1.220 INCHES MAXIMUM IN
memory_capacityUNKNOWN
features_providedHERMETICALLY SEALED AND 3-STATE OUTPUT AND HIGH IMPEDANCE
output_logic_formCOMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC
inclosure_materialCERAMIC
memory_device_typeRAM
storage_temp_range-65.0 TO 150.0 CELSIUS DEGC
operating_temp_range-55.0 TO 125.0 CELSIUS DEGC
input_circuit_pattern22 INPUT
end_item_identificationDATA LINK 76301
NSN5962-01-128-3903
COMPONENT DIAGRAM
COMPONENT MAIN IC EDGE CONNECTOR No detailed specs available MICROCIRCUIT,MEMORY TITLE COMPONENT PN 8751-012 MFR MICROCIRCUIT,MEMORY
KEY FEATURES
•
INPUT CIRCUIT PATTERN: 22 INPUT
•
INCLOSURE MATERIAL: CERAMIC
•
TERMINAL SURFACE TREATMENT: SOLDER
•
BODY WIDTH: 0.480 INCHES MINIMUM AND 0.520 INCHES MAXIMUM IN
•
BODY HEIGHT: 0.070 INCHES MINIMUM AND 0.130 INCHES MAXIMUM IN
•
FEATURES PROVIDED: HERMETICALLY SEALED AND 3-STATE OUTPUT AND HIGH IMPEDANCE
•
INCLOSURE CONFIGURATION: DUAL-IN-LINE
•
MEMORY DEVICE TYPE: RAM
TYPICAL APPLICATIONS
  • Server memory expansion for virtualization workloads
  • Database performance optimization (in-memory computing)
  • VDI and remote desktop session hosting
  • High-performance computing (HPC) clusters
  • Mail server and collaboration platform scaling
  • Application server tier expansion
TECHNICAL CHARACTERISTICS
INPUT CIRCUIT PATTERN22 INPUT
INCLOSURE MATERIALCERAMIC
TERMINAL SURFACE TREATMENTSOLDER
BODY WIDTH0.480 INCHES MINIMUM AND 0.520 INCHES MAXIMUM IN
BODY HEIGHT0.070 INCHES MINIMUM AND 0.130 INCHES MAXIMUM IN
FEATURES PROVIDEDHERMETICALLY SEALED AND 3-STATE OUTPUT AND HIGH IMPEDANCE
INCLOSURE CONFIGURATIONDUAL-IN-LINE
MEMORY DEVICE TYPERAM
BODY LENGTH1.150 INCHES MINIMUM AND 1.220 INCHES MAXIMUM IN
STORAGE TEMP RANGE-65.0 TO 150.0 CELSIUS DEGC
SUBSTITUTES & CROSS-REFERENCES 7
0N272423-1Same NSN cross-reference
Same NSN cross-reference
Also cataloged under this NSN
A3014730-1Reference document
Same NSN cross-reference
Reference document — Secondary reference
5962PL0929678Reference document
Same NSN cross-reference
Reference document — Informative reference only
850138-0001Reference document
Same NSN cross-reference
Reference document — Secondary reference
CDP1823CD/3Reference document
Same NSN cross-reference
Reference document — Secondary reference
CDP1823CD/BSame NSN cross-reference
Same NSN cross-reference
Also cataloged under this NSN
LIFECYCLE
NSN statusActive· U.S. Government catalog
Acquisition advice: Insurance item — stocked against contingency demandDemilitarization required — mutilation + specific procedure
Ready to buy 8751-012?
Compare prices from verified sellers on eBay
Buy on eBay →
As an eBay Partner, PartsTable may earn a commission. Your price is not affected.
FREQUENTLY ASKED QUESTIONS
What is 8751-012?
8751-012 is a MICROCIRCUIT,MEMORY.
What parts can replace 8751-012?
There are 7 known substitutes for 8751-012: 0N272423-1, A3014730-1, 5962PL0929678 and 4 more. Substitute compatibility should be verified for your specific system.
What is the NSN for 8751-012?
8751-012 is cataloged in the U.S. Government catalog under NSN 5962-01-128-3903. This indicates validated use in U.S. government and defense supply chains.
Community Feedback
Leave a Comment
Comments are reviewed before appearing. You will receive an email to verify before your comment appears.

Request a Quote — 8751-012