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Technical Data Sheet
85929300-03 ✓ Verified by PartsTable
· COMPONENT
WHAT YOU NEED TO KNOW
Verify manufacturer and server generation compatibility Check if Option PN or Spare PN — same part, different channel
Confirm exact part number — similar PNs may be different parts
PRODUCT OVERVIEW

The MICROCIRCUIT,DIGITAL is a the manufacturer industrial component. Key specifications include body_width: 0.235 INCHES MINIMUM AND 0.260 INCHES MAXIMUM IN, body_height: 0.045 INCHES MINIMUM AND 0.085 INCHES MAXIMUM IN, body_length: 0.390 INCHES MAXIMUM IN, features_provided: HERMETICALLY SEALED AND MONOLITHIC AND POSITIVE OUTPUTS AND LOW POWER AND SCHOTTKY, output_logic_form: TRANSISTOR-TRANSISTOR LOGIC, inclosure_material: CERAMIC AND GLASS. This product is currently in active production with full OEM support.

This part is cataloged in the Federal Logistics Information System (FLIS) under NSN 5962-01-070-8518, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.

Verify compatibility with your specific system configuration before ordering.

WHERE IT FITS
85929300-03
NSN: 5962-01-070-8518
FSC: 5962
CAGE: 27963 — GENERAL DYNAMICS INFORMATION SYSTEMS INC. DBA GENERAL DYNAMICS ADVANCED INFORMATION SYSTEMS (USA)
SPECIFICATIONS
body_width0.235 INCHES MINIMUM AND 0.260 INCHES MAXIMUM IN
body_height0.045 INCHES MINIMUM AND 0.085 INCHES MAXIMUM IN
body_length0.390 INCHES MAXIMUM IN
features_providedHERMETICALLY SEALED AND MONOLITHIC AND POSITIVE OUTPUTS AND LOW POWER AND SCHOTTKY
output_logic_formTRANSISTOR-TRANSISTOR LOGIC
inclosure_materialCERAMIC AND GLASS
storage_temp_range-65.0 TO 150.0 CELSIUS DEGC
operating_temp_range-55.0 TO 125.0 CELSIUS DEGC
input_circuit_patternDUAL 2 WIDE 2-3 INPUT
inclosure_configurationFLAT PACK
terminal_surface_treatmentSOLDER
terminal_type_and_quantity14 FLAT LEADS
NSN5962-01-070-8518
COMPONENT DIAGRAM
COMPONENT MAIN IC EDGE CONNECTOR No detailed specs available MICROCIRCUIT,DIGITAL TITLE COMPONENT PN 85929300-03 MFR MICROCIRCUIT,DIGITAL
KEY FEATURES
TERMINAL SURFACE TREATMENT: SOLDER
MAXIMUM POWER DISSIPATION RATING: 16.0 MILLIWATTS
BODY HEIGHT: 0.045 INCHES MINIMUM AND 0.085 INCHES MAXIMUM IN
OPERATING TEMP RANGE: -55.0 TO 125.0 CELSIUS DEGC
BODY WIDTH: 0.235 INCHES MINIMUM AND 0.260 INCHES MAXIMUM IN
SPECIFICATION/STANDARD DATA: 81349-MIL-M-38510/304 GOVERNMENT SPECIFICATION
STORAGE TEMP RANGE: -65.0 TO 150.0 CELSIUS DEGC
BODY LENGTH: 0.390 INCHES MAXIMUM IN
TECHNICAL CHARACTERISTICS (FLIS)
TERMINAL SURFACE TREATMENTSOLDER
MAXIMUM POWER DISSIPATION RATING16.0 MILLIWATTS
BODY HEIGHT0.045 INCHES MINIMUM AND 0.085 INCHES MAXIMUM IN
OPERATING TEMP RANGE-55.0 TO 125.0 CELSIUS DEGC
BODY WIDTH0.235 INCHES MINIMUM AND 0.260 INCHES MAXIMUM IN
SPECIFICATION/STANDARD DATA81349-MIL-M-38510/304 GOVERNMENT SPECIFICATION
STORAGE TEMP RANGE-65.0 TO 150.0 CELSIUS DEGC
BODY LENGTH0.390 INCHES MAXIMUM IN
INCLOSURE CONFIGURATIONFLAT PACK
INCLOSURE MATERIALCERAMIC AND GLASS
VERIFIED SUBSTITUTES & CROSS-REFERENCES 31
SN54LS51WInterchangeable
interchangeable cross-reference
interchangeable
615329-904Interchangeable
interchangeable cross-reference
interchangeable
432208069561Interchangeable
interchangeable cross-reference
interchangeable
404584-46Interchangeable
interchangeable cross-reference
interchangeable
MIL-M-38510/304Interchangeable
interchangeable cross-reference
interchangeable
M38510/30402BABInterchangeable
interchangeable cross-reference
interchangeable
LIFECYCLE
StatusACTIVE
AvailabilityOEM and secondary market
RoHS CompliantEAR99ESD SensitiveNot HAZMAT
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FREQUENTLY ASKED QUESTIONS
What is 85929300-03?
85929300-03 is a MICROCIRCUIT,DIGITAL.
What parts can replace 85929300-03?
There are 31 known substitutes for 85929300-03: SN54LS51W, 615329-904, 432208069561 and 28 more. Substitute compatibility should be verified for your specific system.
What is the NSN for 85929300-03?
85929300-03 is cataloged in the Federal Logistics Information System (FLIS) under NSN 5962-01-070-8518. This indicates validated use in U.S. government and defense supply chains.
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