8563303 — MICROCIRCUIT,MEMORY

✓ Government record, cited

— · COMPONENT

PRODUCT OVERVIEW

8563303: MICROCIRCUIT,MEMORY.

The MICROCIRCUIT,MEMORY is a the manufacturer memory module engineered for enterprise server and workstation platforms requiring validated, high-reliability memory. Key specifications include body_width: 0.600 INCHES MAXIMUM IN, body_height: 0.217 INCHES NOMINAL IN, body_length: 1.285 INCHES MAXIMUM IN, features_provided: MONOLITHIC AND HERMETICALLY SEALED AND PROGRAMMABLE, output_logic_form: METAL OXIDE-SEMICONDUCTOR LOGIC, inclosure_material: CERAMIC. This part is cataloged in the U.S.

Government catalog under NSN 5962-01-217-4202, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.

Verify compatibility with your specific system configuration before ordering.

WHERE IT FITS

8563303

NSN: 5962-01-217-4202
FSC: 5962 — Microcircuits, Electronic
CAGE: 49671 — LOCKHEED MARTIN CORPORATION DBA LOCKHEED MARTIN DIV LOCKHEED MARTIN (USA)

SPECIFICATIONS

body_width	0.600 INCHES MAXIMUM IN
body_height	0.217 INCHES NOMINAL IN
body_length	1.285 INCHES MAXIMUM IN
features_provided	MONOLITHIC AND HERMETICALLY SEALED AND PROGRAMMABLE
output_logic_form	METAL OXIDE-SEMICONDUCTOR LOGIC
inclosure_material	CERAMIC
memory_device_type	ROM
storage_temp_range	-65.0 TO 125.0 CELSIUS DEGC
operating_temp_range	-10.0 TO 80.0 CELSIUS DEGC
input_circuit_pattern	13 INPUT
inclosure_configuration	DUAL-IN-LINE
terminal_surface_treatment	SOLDER
NSN	5962-01-217-4202

COMPONENT DIAGRAM

KEY FEATURES

•

INPUT CIRCUIT PATTERN: 13 INPUT

•

INCLOSURE MATERIAL: CERAMIC

•

TERMINAL SURFACE TREATMENT: SOLDER

•

BODY WIDTH: 0.600 INCHES MAXIMUM IN

•

BODY HEIGHT: 0.217 INCHES NOMINAL IN

•

FEATURES PROVIDED: MONOLITHIC AND HERMETICALLY SEALED AND PROGRAMMABLE

•

INCLOSURE CONFIGURATION: DUAL-IN-LINE

•

MEMORY DEVICE TYPE: ROM

TYPICAL APPLICATIONS

Server memory expansion for virtualization workloads
Database performance optimization (in-memory computing)
VDI and remote desktop session hosting
High-performance computing (HPC) clusters
Mail server and collaboration platform scaling
Application server tier expansion

TECHNICAL CHARACTERISTICS

INPUT CIRCUIT PATTERN	13 INPUT
INCLOSURE MATERIAL	CERAMIC
TERMINAL SURFACE TREATMENT	SOLDER
BODY WIDTH	0.600 INCHES MAXIMUM IN
BODY HEIGHT	0.217 INCHES NOMINAL IN
FEATURES PROVIDED	MONOLITHIC AND HERMETICALLY SEALED AND PROGRAMMABLE
INCLOSURE CONFIGURATION	DUAL-IN-LINE
MEMORY DEVICE TYPE	ROM
BODY LENGTH	1.285 INCHES MAXIMUM IN
STORAGE TEMP RANGE	-65.0 TO 125.0 CELSIUS DEGC

SUBSTITUTES & CROSS-REFERENCES 3

D2716-45Reference document

Same NSN cross-reference

Reference document — Secondary reference

ROM/PROMReference document

Same NSN cross-reference

Reference document — Secondary reference

8559989-53Reference document

Same NSN cross-reference

Reference document — Design control — primary reference

LIFECYCLE

NSN statusActive· U.S. Government catalog

Acquisition advice: Insurance item — stocked against contingency demandDemilitarization required — critical (Q)

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FREQUENTLY ASKED QUESTIONS

What is 8563303?

8563303 is a MICROCIRCUIT,MEMORY.

What parts can replace 8563303?

There are 3 known substitutes for 8563303: D2716-45, ROM/PROM, 8559989-53. Substitute compatibility should be verified for your specific system.

What is the NSN for 8563303?

8563303 is cataloged in the U.S. Government catalog under NSN 5962-01-217-4202. This indicates validated use in U.S. government and defense supply chains.

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8563303 — MICROCIRCUIT,MEMORY

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