8561777-10 — MICROCIRCUIT,MEMORY

✓ Government record, cited

— · COMPONENT

PRODUCT OVERVIEW

8561777-10: MICROCIRCUIT,MEMORY.

The MICROCIRCUIT,MEMORY is a the manufacturer memory module engineered for enterprise server and workstation platforms requiring validated, high-reliability memory. Key specifications include body_width: 0.535 INCHES MAXIMUM IN, body_height: 0.160 INCHES MAXIMUM IN, body_length: 1.255 INCHES MAXIMUM IN, features_provided: BIPOLAR AND PROGRAMMABLE AND SCHOTTKY, output_logic_form: TRANSISTOR-TRANSISTOR LOGIC, inclosure_material: CERAMIC. This part is cataloged in the U.S.

Government catalog under NSN 5962-01-217-5602, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.

Verify compatibility with your specific system configuration before ordering.

WHERE IT FITS

8561777-10

NSN: 5962-01-217-5602
FSC: 5962 — Microcircuits, Electronic
CAGE: 11447 — L3 TECHNOLOGIES, INC. DIV COMMUNICATION SYSTEMS-EAST (USA)

SPECIFICATIONS

body_width	0.535 INCHES MAXIMUM IN
body_height	0.160 INCHES MAXIMUM IN
body_length	1.255 INCHES MAXIMUM IN
features_provided	BIPOLAR AND PROGRAMMABLE AND SCHOTTKY
output_logic_form	TRANSISTOR-TRANSISTOR LOGIC
inclosure_material	CERAMIC
memory_device_type	ROM
storage_temp_range	-65.0 TO 150.0 CELSIUS DEGC
operating_temp_range	+0.0 TO 75.0 CELSIUS DEGC
input_circuit_pattern	14 INPUT
inclosure_configuration	DUAL-IN-LINE
terminal_surface_treatment	SOLDER
NSN	5962-01-217-5602

COMPONENT DIAGRAM

KEY FEATURES

•

INPUT CIRCUIT PATTERN: 14 INPUT

•

INCLOSURE MATERIAL: CERAMIC

•

TERMINAL SURFACE TREATMENT: SOLDER

•

BODY WIDTH: 0.535 INCHES MAXIMUM IN

•

BODY HEIGHT: 0.160 INCHES MAXIMUM IN

•

FEATURES PROVIDED: BIPOLAR AND PROGRAMMABLE AND SCHOTTKY

•

INCLOSURE CONFIGURATION: DUAL-IN-LINE

•

MEMORY DEVICE TYPE: ROM

TYPICAL APPLICATIONS

Server memory expansion for virtualization workloads
Database performance optimization (in-memory computing)
VDI and remote desktop session hosting
High-performance computing (HPC) clusters
Mail server and collaboration platform scaling
Application server tier expansion

TECHNICAL CHARACTERISTICS

INPUT CIRCUIT PATTERN	14 INPUT
INCLOSURE MATERIAL	CERAMIC
TERMINAL SURFACE TREATMENT	SOLDER
BODY WIDTH	0.535 INCHES MAXIMUM IN
BODY HEIGHT	0.160 INCHES MAXIMUM IN
FEATURES PROVIDED	BIPOLAR AND PROGRAMMABLE AND SCHOTTKY
INCLOSURE CONFIGURATION	DUAL-IN-LINE
MEMORY DEVICE TYPE	ROM
BODY LENGTH	1.255 INCHES MAXIMUM IN
STORAGE TEMP RANGE	-65.0 TO 150.0 CELSIUS DEGC

SUBSTITUTES & CROSS-REFERENCES 3

ROM/PROMReference document

Same NSN cross-reference

Reference document — Secondary reference

8564167Reference document

Same NSN cross-reference

Reference document — Secondary reference

AM27S35DCReference document

Same NSN cross-reference

Reference document — Secondary reference

LIFECYCLE

NSN statusActive· U.S. Government catalog

Acquisition advice: Insurance item — stocked against contingency demandDemilitarization required — critical (Q)

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FREQUENTLY ASKED QUESTIONS

What is 8561777-10?

8561777-10 is a MICROCIRCUIT,MEMORY.

What parts can replace 8561777-10?

There are 3 known substitutes for 8561777-10: ROM/PROM, 8564167, AM27S35DC. Substitute compatibility should be verified for your specific system.

What is the NSN for 8561777-10?

8561777-10 is cataloged in the U.S. Government catalog under NSN 5962-01-217-5602. This indicates validated use in U.S. government and defense supply chains.

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8561777-10 — MICROCIRCUIT,MEMORY

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