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8521863-5 — MICROCIRCUIT,MEMORY

✓ Government record, cited
— · COMPONENT
PRODUCT OVERVIEW

8521863-5: MICROCIRCUIT,MEMORY.

The MICROCIRCUIT,MEMORY is a the manufacturer memory module engineered for enterprise server and workstation platforms requiring validated, high-reliability memory. Key specifications include memory_capacity: 64K X 18, features_provided: W/CLOCK, memory_device_type: FIRST-IN FIRST-OUT, operating_temp_range: -40.0 TO 85.0 CELSIUS DEGC, end_item_identification: MV-22 AIRCRAFT; GENERATOR, AIRCRAFT (1680-01-519-1437), inclosure_configuration: FLAT PACK. This part is cataloged in the U.S.

Government catalog under NSN 5962-01-593-0130, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.

Verify compatibility with your specific system configuration before ordering.

WHERE IT FITS
8521863-5
NSN: 5962-01-593-0130
FSC: 5962 — Microcircuits, Electronic
CAGE: 07187 — HONEYWELL INTERNATIONAL INC. DBA HONEYWELL INTERNATIONAL (USA)
SPECIFICATIONS
memory_capacity64K X 18
features_providedW/CLOCK
memory_device_typeFIRST-IN FIRST-OUT
operating_temp_range-40.0 TO 85.0 CELSIUS DEGC
end_item_identificationMV-22 AIRCRAFT; GENERATOR, AIRCRAFT (1680-01-519-1437)
inclosure_configurationFLAT PACK
terminal_type_and_quantity64 FLAT LEADS
part_name_assigned_by_controlling_agencyDRAWING: MEMORY, FIRST-IN FIRST-OUT (FIFO), 64K X 18, 15 NS, CLOCKED READ AND WRITE INTERFACES, 64-LEAD THIN QUAD FLATPACK, INDUSTRIAL OPERATING TEMPERATURE (-40 DEG C TO +85 DEG C) DEGC
NSN5962-01-593-0130
COMPONENT DIAGRAM
COMPONENT MAIN IC EDGE CONNECTOR No detailed specs available MICROCIRCUIT,MEMORY TITLE COMPONENT PN 8521863-5 MFR MICROCIRCUIT,MEMORY
KEY FEATURES
•
FEATURES PROVIDED: W/CLOCK
•
INCLOSURE CONFIGURATION: FLAT PACK
•
MEMORY DEVICE TYPE: FIRST-IN FIRST-OUT
•
OPERATING TEMP RANGE: -40.0 TO 85.0 CELSIUS DEGC
•
TERMINAL TYPE AND QUANTITY: 64 FLAT LEADS
•
MEMORY CAPACITY: 64K X 18
TYPICAL APPLICATIONS
  • Server memory expansion for virtualization workloads
  • Database performance optimization (in-memory computing)
  • VDI and remote desktop session hosting
  • High-performance computing (HPC) clusters
  • Mail server and collaboration platform scaling
  • Application server tier expansion
TECHNICAL CHARACTERISTICS
FEATURES PROVIDEDW/CLOCK
INCLOSURE CONFIGURATIONFLAT PACK
MEMORY DEVICE TYPEFIRST-IN FIRST-OUT
OPERATING TEMP RANGE-40.0 TO 85.0 CELSIUS DEGC
PART NAME ASSIGNED BY CONTROLLING AGENCYDRAWING: MEMORY, FIRST-IN FIRST-OUT (FIFO), 64K X 18, 15 NS, CLOCKED READ AND WRITE INTERFACES, 64-LEAD THIN QUAD FLATPACK, INDUSTRIAL OPERATING TEMPERATURE (-40 DEG C TO +85 DEG C) DEGC
END ITEM IDENTIFICATIONMV-22 AIRCRAFT; GENERATOR, AIRCRAFT (1680-01-519-1437)
TERMINAL TYPE AND QUANTITY64 FLAT LEADS
MEMORY CAPACITY64K X 18
OTHER ITEMS IN FSC 5962 — Microcircuits, Electronic
Items in the same Federal Supply class. No interchangeability or substitution relationship is implied.
5962-00-001-1861 5962-00-001-1901 5962-00-001-1902 5962-00-001-1905 5962-00-001-1906 5962-00-001-1907 5962-00-001-1908 5962-00-001-1909
SUBSTITUTES & CROSS-REFERENCES 1
CY7C4285-15ASIReference document
Same NSN cross-reference
Reference document — Secondary reference
LIFECYCLE
NSN statusActive· U.S. Government catalog
Acquisition advice: Insurance item — stocked against contingency demandDemilitarization required — mutilation + specific procedure
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FREQUENTLY ASKED QUESTIONS
What is 8521863-5?
8521863-5 is a MICROCIRCUIT,MEMORY.
What parts can replace 8521863-5?
There is 1 known substitute for 8521863-5: CY7C4285-15ASI. Substitute compatibility should be verified for your specific system.
What is the NSN for 8521863-5?
8521863-5 is cataloged in the U.S. Government catalog under NSN 5962-01-593-0130. This indicates validated use in U.S. government and defense supply chains.
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