8515777-100 — MICROCIRCUIT,DIGITAL

✓ Government record, cited

— · COMPONENT

PRODUCT OVERVIEW

8515777-100: MICROCIRCUIT,DIGITAL.

The MICROCIRCUIT,DIGITAL is a the manufacturer industrial component. Key specifications include body_width: 0.342 INCHES MINIMUM AND 0.358 INCHES MAXIMUM IN, body_height: 0.060 INCHES MINIMUM AND 0.100 INCHES MAXIMUM IN, body_length: 0.342 INCHES MINIMUM AND 0.358 INCHES MAXIMUM IN, features_provided: BIPOLAR AND BURN IN AND ELECTROSTATIC SENSITIVE AND PROGRAMMED AND MONOLITHIC, output_logic_form: TRANSISTOR-TRANSISTOR LOGIC, inclosure_material: CERAMIC. This part is cataloged in the U.S.

Government catalog under NSN 5962-01-344-0786, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.

Verify compatibility with your specific system configuration before ordering.

WHERE IT FITS

8515777-100

NSN: 5962-01-344-0786
FSC: 5962 — Microcircuits, Electronic
CAGE: 07187 — HONEYWELL INTERNATIONAL INC. DBA HONEYWELL INTERNATIONAL (USA)

SPECIFICATIONS

body_width	0.342 INCHES MINIMUM AND 0.358 INCHES MAXIMUM IN
body_height	0.060 INCHES MINIMUM AND 0.100 INCHES MAXIMUM IN
body_length	0.342 INCHES MINIMUM AND 0.358 INCHES MAXIMUM IN
features_provided	BIPOLAR AND BURN IN AND ELECTROSTATIC SENSITIVE AND PROGRAMMED AND MONOLITHIC
output_logic_form	TRANSISTOR-TRANSISTOR LOGIC
inclosure_material	CERAMIC
memory_device_type	PROGRAMMED
storage_temp_range	-65.0 TO 150.0 CELSIUS DEGC
test_data_document	96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.).
operating_temp_range	-55.0 TO 125.0 CELSIUS DEGC
input_circuit_pattern	16 INPUT
inclosure_configuration	LEADLESS FLAT PACK
NSN	5962-01-344-0786

COMPONENT DIAGRAM

KEY FEATURES

•

INPUT CIRCUIT PATTERN: 16 INPUT

•

INCLOSURE MATERIAL: CERAMIC

•

TERMINAL SURFACE TREATMENT: SOLDER

•

BODY WIDTH: 0.342 INCHES MINIMUM AND 0.358 INCHES MAXIMUM IN

•

BODY HEIGHT: 0.060 INCHES MINIMUM AND 0.100 INCHES MAXIMUM IN

•

FEATURES PROVIDED: BIPOLAR AND BURN IN AND ELECTROSTATIC SENSITIVE AND PROGRAMMED AND MONOLITHIC

•

INCLOSURE CONFIGURATION: LEADLESS FLAT PACK

•

MEMORY DEVICE TYPE: PROGRAMMED

TECHNICAL CHARACTERISTICS

INPUT CIRCUIT PATTERN	16 INPUT
INCLOSURE MATERIAL	CERAMIC
TERMINAL SURFACE TREATMENT	SOLDER
BODY WIDTH	0.342 INCHES MINIMUM AND 0.358 INCHES MAXIMUM IN
BODY HEIGHT	0.060 INCHES MINIMUM AND 0.100 INCHES MAXIMUM IN
FEATURES PROVIDED	BIPOLAR AND BURN IN AND ELECTROSTATIC SENSITIVE AND PROGRAMMED AND MONOLITHIC
INCLOSURE CONFIGURATION	LEADLESS FLAT PACK
MEMORY DEVICE TYPE	PROGRAMMED
CASE OUTLINE SOURCE AND DESIGNATOR	C-2 MIL-M-38510
BODY LENGTH	0.342 INCHES MINIMUM AND 0.358 INCHES MAXIMUM IN

SUBSTITUTES & CROSS-REFERENCES 4

10133920Reference document

Same NSN cross-reference

Reference document — Informative reference only

ROM/PROMReference document

Same NSN cross-reference

Reference document — Secondary reference

81036082AReference document

Same NSN cross-reference

Reference document — Secondary reference

8507006-142Reference document

Same NSN cross-reference

Reference document — Secondary reference

LIFECYCLE

NSN statusActive· U.S. Government catalog

Acquisition advice: Insurance item — stocked against contingency demandDemilitarization required — mutilation + specific procedure

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FREQUENTLY ASKED QUESTIONS

What is 8515777-100?

8515777-100 is a MICROCIRCUIT,DIGITAL.

What parts can replace 8515777-100?

There are 4 known substitutes for 8515777-100: 10133920, ROM/PROM, 81036082A and 1 more. Substitute compatibility should be verified for your specific system.

What is the NSN for 8515777-100?

8515777-100 is cataloged in the U.S. Government catalog under NSN 5962-01-344-0786. This indicates validated use in U.S. government and defense supply chains.

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8515777-100 — MICROCIRCUIT,DIGITAL

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