8514413-100 — MICROCIRCUIT,MEMORY

✓ Government record, cited

— · COMPONENT

PRODUCT OVERVIEW

8514413-100: MICROCIRCUIT,MEMORY.

The MICROCIRCUIT,MEMORY is a the manufacturer memory module engineered for enterprise server and workstation platforms requiring validated, high-reliability memory. Key specifications include body_width: 11.2 MILLIMETERS MINIMUM AND 11.7 MILLIMETERS MAXIMUM MM, body_height: 1.5 MILLIMETERS MINIMUM AND 2.5 MILLIMETERS MAXIMUM MM, body_length: 11.2 MILLIMETERS MINIMUM AND 11.7 MILLIMETERS MAXIMUM MM, features_provided: PROGRAMMED, output_logic_form: COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC, inclosure_material: CERAMIC. This part is cataloged in the U.S.

Government catalog under NSN 5962-01-384-7819, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.

Verify compatibility with your specific system configuration before ordering.

WHERE IT FITS

8514413-100

NSN: 5962-01-384-7819
FSC: 5962 — Microcircuits, Electronic
CAGE: 07187 — HONEYWELL INTERNATIONAL INC. DBA HONEYWELL INTERNATIONAL (USA)

SPECIFICATIONS

body_width	11.2 MILLIMETERS MINIMUM AND 11.7 MILLIMETERS MAXIMUM MM
body_height	1.5 MILLIMETERS MINIMUM AND 2.5 MILLIMETERS MAXIMUM MM
body_length	11.2 MILLIMETERS MINIMUM AND 11.7 MILLIMETERS MAXIMUM MM
features_provided	PROGRAMMED
output_logic_form	COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC
inclosure_material	CERAMIC
memory_device_type	PROM
storage_temp_range	-65.0 TO 150.0 CELSIUS DEGC
operating_temp_range	-55.0 TO 125.0 CELSIUS DEGC
inclosure_configuration	LEADLESS FLAT PACK
terminal_surface_treatment	SOLDER
terminal_type_and_quantity	28 LEADLESS
NSN	5962-01-384-7819

COMPONENT DIAGRAM

KEY FEATURES

•

INCLOSURE MATERIAL: CERAMIC

•

TERMINAL SURFACE TREATMENT: SOLDER

•

BODY WIDTH: 11.2 MILLIMETERS MINIMUM AND 11.7 MILLIMETERS MAXIMUM MM

•

BODY HEIGHT: 1.5 MILLIMETERS MINIMUM AND 2.5 MILLIMETERS MAXIMUM MM

•

FEATURES PROVIDED: PROGRAMMED

•

INCLOSURE CONFIGURATION: LEADLESS FLAT PACK

•

CURRENT RATING PER CHARACTERISTIC: 120.00 MILLIAMPERES NOMINAL TOTAL SUPPLY

•

MEMORY DEVICE TYPE: PROM

TYPICAL APPLICATIONS

Server memory expansion for virtualization workloads
Database performance optimization (in-memory computing)
VDI and remote desktop session hosting
High-performance computing (HPC) clusters
Mail server and collaboration platform scaling
Application server tier expansion

TECHNICAL CHARACTERISTICS

INCLOSURE MATERIAL	CERAMIC
TERMINAL SURFACE TREATMENT	SOLDER
BODY WIDTH	11.2 MILLIMETERS MINIMUM AND 11.7 MILLIMETERS MAXIMUM MM
BODY HEIGHT	1.5 MILLIMETERS MINIMUM AND 2.5 MILLIMETERS MAXIMUM MM
FEATURES PROVIDED	PROGRAMMED
INCLOSURE CONFIGURATION	LEADLESS FLAT PACK
CURRENT RATING PER CHARACTERISTIC	120.00 MILLIAMPERES NOMINAL TOTAL SUPPLY
MEMORY DEVICE TYPE	PROM
BODY LENGTH	11.2 MILLIMETERS MINIMUM AND 11.7 MILLIMETERS MAXIMUM MM
STORAGE TEMP RANGE	-65.0 TO 150.0 CELSIUS DEGC

SUBSTITUTES & CROSS-REFERENCES 4

10133910Reference document

Same NSN cross-reference

Reference document — Informative reference only

8507005-227Reference document

Same NSN cross-reference

Reference document — Secondary reference

ROM/PROMReference document

Same NSN cross-reference

Reference document — Secondary reference

5962-88636013AReference document

Same NSN cross-reference

Reference document — Secondary reference

LIFECYCLE

NSN statusActive· U.S. Government catalog

Acquisition advice: Insurance item — stocked against contingency demandNo demilitarization required

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FREQUENTLY ASKED QUESTIONS

What is 8514413-100?

8514413-100 is a MICROCIRCUIT,MEMORY.

What parts can replace 8514413-100?

There are 4 known substitutes for 8514413-100: 10133910, 8507005-227, ROM/PROM and 1 more. Substitute compatibility should be verified for your specific system.

What is the NSN for 8514413-100?

8514413-100 is cataloged in the U.S. Government catalog under NSN 5962-01-384-7819. This indicates validated use in U.S. government and defense supply chains.

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