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8513501YA — MICROCIRCUIT,MEMORY

✓ Government record, cited
— · COMPONENT
PRODUCT OVERVIEW

8513501YA: MICROCIRCUIT,MEMORY.

The MICROCIRCUIT,MEMORY is a the manufacturer memory module engineered for enterprise server and workstation platforms requiring validated, high-reliability memory. Key specifications include body_width: 0.500 INCHES MINIMUM AND 0.610 INCHES MAXIMUM IN, body_height: 0.172 INCHES MINIMUM AND 0.217 INCHES MAXIMUM IN, body_length: 1.490 INCHES MAXIMUM IN, bit_quantity: 524288, word_quantity: 65536, overall_height: 0.432 INCHES MAXIMUM IN. This part is cataloged in the U.S.

Government catalog under NSN 5962-01-326-2822, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.

Verify compatibility with your specific system configuration before ordering.

WHERE IT FITS
8513501YA
NSN: 5962-01-326-2822
FSC: 5962 — Microcircuits, Electronic
CAGE: 67268 — DLA LAND AND MARITIME DBA ENGINEERING AND TECHNICAL SUPPORT DIV DOCUMENT STANDARDIZATION DIVISION (STANDARD MICROCIRCUIT (USA)
SPECIFICATIONS
body_width0.500 INCHES MINIMUM AND 0.610 INCHES MAXIMUM IN
body_height0.172 INCHES MINIMUM AND 0.217 INCHES MAXIMUM IN
body_length1.490 INCHES MAXIMUM IN
bit_quantity524288
word_quantity65536
overall_height0.432 INCHES MAXIMUM IN
special_featuresNUCLEAR HARDNESS CRITICAL ITEM
features_providedULTRAVIOLET ERASABLE AND MONOLITHIC AND PROGRAMMABLE AND W/BUFFERED OUTPUT AND W/ENABLE AND ELECTROSTATIC SENSITIVE
output_logic_formCOMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC
inclosure_materialCERAMIC
memory_device_typeROM
storage_temp_range-65.0 TO 150.0 CELSIUS DEGC
NSN5962-01-326-2822
COMPONENT DIAGRAM
COMPONENT MAIN IC EDGE CONNECTOR No detailed specs available MICROCIRCUIT,MEMORY TITLE COMPONENT PN 8513501YA MFR MICROCIRCUIT,MEMORY
KEY FEATURES
•
BIT QUANTITY: 524288
•
INPUT CIRCUIT PATTERN: 18 INPUT
•
WORD QUANTITY: 65536
•
INCLOSURE MATERIAL: CERAMIC
•
TERMINAL SURFACE TREATMENT: SOLDER
•
BODY WIDTH: 0.500 INCHES MINIMUM AND 0.610 INCHES MAXIMUM IN
•
BODY HEIGHT: 0.172 INCHES MINIMUM AND 0.217 INCHES MAXIMUM IN
TYPICAL APPLICATIONS
  • Server memory expansion for virtualization workloads
  • Database performance optimization (in-memory computing)
  • VDI and remote desktop session hosting
  • High-performance computing (HPC) clusters
  • Mail server and collaboration platform scaling
  • Application server tier expansion
TECHNICAL CHARACTERISTICS
BIT QUANTITY524288
OVERALL HEIGHT0.432 INCHES MAXIMUM IN
INPUT CIRCUIT PATTERN18 INPUT
WORD QUANTITY65536
INCLOSURE MATERIALCERAMIC
TERMINAL SURFACE TREATMENTSOLDER
BODY WIDTH0.500 INCHES MINIMUM AND 0.610 INCHES MAXIMUM IN
BODY HEIGHT0.172 INCHES MINIMUM AND 0.217 INCHES MAXIMUM IN
CRITICALITY CODE JUSTIFICATIONFEAT
FEATURES PROVIDEDULTRAVIOLET ERASABLE AND MONOLITHIC AND PROGRAMMABLE AND W/BUFFERED OUTPUT AND W/ENABLE AND ELECTROSTATIC SENSITIVE
SUBSTITUTES & CROSS-REFERENCES 9
AM27C512-250/BXAReference document
Same NSN cross-reference
Reference document — Secondary reference
MD27512-251BReference document
Same NSN cross-reference
Reference document — Secondary reference
5962-8764803BXAReference document
Same NSN cross-reference
Reference document — Secondary reference
ROM/PROMReference document
Same NSN cross-reference
Reference document — Secondary reference
NH85-49118-001Reference document
Same NSN cross-reference
Reference document — Secondary reference
5962-8764803XAReference document
Same NSN cross-reference
Reference document — Secondary reference
LIFECYCLE
NSN statusActive· U.S. Government catalog
Demilitarization required — critical (Q)
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FREQUENTLY ASKED QUESTIONS
What is 8513501YA?
8513501YA is a MICROCIRCUIT,MEMORY.
What parts can replace 8513501YA?
There are 9 known substitutes for 8513501YA: AM27C512-250/BXA, MD27512-251B, 5962-8764803BXA and 6 more. Substitute compatibility should be verified for your specific system.
What is the NSN for 8513501YA?
8513501YA is cataloged in the U.S. Government catalog under NSN 5962-01-326-2822. This indicates validated use in U.S. government and defense supply chains.
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