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8512150-101 — MICROCIRCUIT,MEMORY

✓ Government record, cited
— · COMPONENT
PRODUCT OVERVIEW

8512150-101: MICROCIRCUIT,MEMORY.

The MICROCIRCUIT,MEMORY is a the manufacturer memory module engineered for enterprise server and workstation platforms requiring validated, high-reliability memory. Key specifications include features_provided: MONOLITHIC AND PROGRAMMABLE, output_logic_form: COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC, inclosure_material: CERAMIC, memory_device_type: PROGRAMMABLE, inclosure_configuration: DUAL-IN-LINE, terminal_surface_treatment: SOLDER. This part is cataloged in the U.S.

Government catalog under NSN 5962-01-339-8969, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.

Verify compatibility with your specific system configuration before ordering.

WHERE IT FITS
8512150-101
NSN: 5962-01-339-8969
FSC: 5962 — Microcircuits, Electronic
CAGE: 07187 — HONEYWELL INTERNATIONAL INC. DBA HONEYWELL INTERNATIONAL (USA)
SPECIFICATIONS
features_providedMONOLITHIC AND PROGRAMMABLE
output_logic_formCOMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC
inclosure_materialCERAMIC
memory_device_typePROGRAMMABLE
inclosure_configurationDUAL-IN-LINE
terminal_surface_treatmentSOLDER
part_name_assigned_by_controlling_agencyEPLD
NSN5962-01-339-8969
COMPONENT DIAGRAM
COMPONENT MAIN IC EDGE CONNECTOR No detailed specs available MICROCIRCUIT,MEMORY TITLE COMPONENT PN 8512150-101 MFR MICROCIRCUIT,MEMORY
KEY FEATURES
•
INCLOSURE MATERIAL: CERAMIC
•
TERMINAL SURFACE TREATMENT: SOLDER
•
FEATURES PROVIDED: MONOLITHIC AND PROGRAMMABLE
•
INCLOSURE CONFIGURATION: DUAL-IN-LINE
•
MEMORY DEVICE TYPE: PROGRAMMABLE
•
OUTPUT LOGIC FORM: COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC
•
TERMINAL TYPE AND QUANTITY: 24 PRINTED CIRCUIT
TYPICAL APPLICATIONS
  • Server memory expansion for virtualization workloads
  • Database performance optimization (in-memory computing)
  • VDI and remote desktop session hosting
  • High-performance computing (HPC) clusters
  • Mail server and collaboration platform scaling
  • Application server tier expansion
TECHNICAL CHARACTERISTICS
INCLOSURE MATERIALCERAMIC
TERMINAL SURFACE TREATMENTSOLDER
FEATURES PROVIDEDMONOLITHIC AND PROGRAMMABLE
INCLOSURE CONFIGURATIONDUAL-IN-LINE
MEMORY DEVICE TYPEPROGRAMMABLE
OUTPUT LOGIC FORMCOMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC
PART NAME ASSIGNED BY CONTROLLING AGENCYEPLD
TERMINAL TYPE AND QUANTITY24 PRINTED CIRCUIT
SUBSTITUTES & CROSS-REFERENCES 3
10133937Reference document
Same NSN cross-reference
Reference document — Informative reference only
8507006-130Reference document
Same NSN cross-reference
Reference document — Secondary reference
ROM/PROMReference document
Same NSN cross-reference
Reference document — Secondary reference
LIFECYCLE
NSN statusActive· U.S. Government catalog
Acquisition advice: Insurance item — stocked against contingency demandDemilitarization required — critical (Q)
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FREQUENTLY ASKED QUESTIONS
What is 8512150-101?
8512150-101 is a MICROCIRCUIT,MEMORY.
What parts can replace 8512150-101?
There are 3 known substitutes for 8512150-101: 10133937, 8507006-130, ROM/PROM. Substitute compatibility should be verified for your specific system.
What is the NSN for 8512150-101?
8512150-101 is cataloged in the U.S. Government catalog under NSN 5962-01-339-8969. This indicates validated use in U.S. government and defense supply chains.
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