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8511874-757 — MICROCIRCUIT,MEMORY

✓ Government record, cited
— · COMPONENT
PRODUCT OVERVIEW

8511874-757: MICROCIRCUIT,MEMORY.

The MICROCIRCUIT,MEMORY is a the manufacturer memory module engineered for enterprise server and workstation platforms requiring validated, high-reliability memory. Key specifications include body_width: 0.542 INCHES MINIMUM AND 0.558 INCHES MAXIMUM IN, body_height: 0.074 INCHES MINIMUM AND 0.086 INCHES MAXIMUM IN, body_length: 0.542 INCHES MINIMUM AND 0.558 INCHES MAXIMUM IN, features_provided: HERMETICALLY SEALED AND BURN IN AND HIGH SPEED AND STATIC OPERATION, output_logic_form: COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC, inclosure_material: CERAMIC. This part is cataloged in the U.S.

Government catalog under NSN 5962-01-330-5523, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.

Verify compatibility with your specific system configuration before ordering.

WHERE IT FITS
8511874-757
NSN: 5962-01-330-5523
FSC: 5962 — Microcircuits, Electronic
CAGE: 07187 — HONEYWELL INTERNATIONAL INC. DBA HONEYWELL INTERNATIONAL (USA)
SPECIFICATIONS
body_width0.542 INCHES MINIMUM AND 0.558 INCHES MAXIMUM IN
body_height0.074 INCHES MINIMUM AND 0.086 INCHES MAXIMUM IN
body_length0.542 INCHES MINIMUM AND 0.558 INCHES MAXIMUM IN
features_providedHERMETICALLY SEALED AND BURN IN AND HIGH SPEED AND STATIC OPERATION
output_logic_formCOMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC
inclosure_materialCERAMIC
memory_device_typeRAM
storage_temp_range-65.0 TO 150.0 CELSIUS DEGC
test_data_document96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.).
operating_temp_range-55.0 TO 125.0 CELSIUS DEGC
input_circuit_pattern26 INPUT
inclosure_configurationLEADLESS FLAT PACK
NSN5962-01-330-5523
COMPONENT DIAGRAM
COMPONENT MAIN IC EDGE CONNECTOR No detailed specs available MICROCIRCUIT,MEMORY TITLE COMPONENT PN 8511874-757 MFR MICROCIRCUIT,MEMORY
KEY FEATURES
•
INPUT CIRCUIT PATTERN: 26 INPUT
•
INCLOSURE MATERIAL: CERAMIC
•
TERMINAL SURFACE TREATMENT: SOLDER
•
BODY WIDTH: 0.542 INCHES MINIMUM AND 0.558 INCHES MAXIMUM IN
•
BODY HEIGHT: 0.074 INCHES MINIMUM AND 0.086 INCHES MAXIMUM IN
•
FEATURES PROVIDED: HERMETICALLY SEALED AND BURN IN AND HIGH SPEED AND STATIC OPERATION
•
INCLOSURE CONFIGURATION: LEADLESS FLAT PACK
•
MEMORY DEVICE TYPE: RAM
TYPICAL APPLICATIONS
  • Server memory expansion for virtualization workloads
  • Database performance optimization (in-memory computing)
  • VDI and remote desktop session hosting
  • High-performance computing (HPC) clusters
  • Mail server and collaboration platform scaling
  • Application server tier expansion
TECHNICAL CHARACTERISTICS
INPUT CIRCUIT PATTERN26 INPUT
INCLOSURE MATERIALCERAMIC
TERMINAL SURFACE TREATMENTSOLDER
BODY WIDTH0.542 INCHES MINIMUM AND 0.558 INCHES MAXIMUM IN
BODY HEIGHT0.074 INCHES MINIMUM AND 0.086 INCHES MAXIMUM IN
FEATURES PROVIDEDHERMETICALLY SEALED AND BURN IN AND HIGH SPEED AND STATIC OPERATION
INCLOSURE CONFIGURATIONLEADLESS FLAT PACK
MEMORY DEVICE TYPERAM
BODY LENGTH0.542 INCHES MINIMUM AND 0.558 INCHES MAXIMUM IN
STORAGE TEMP RANGE-65.0 TO 150.0 CELSIUS DEGC
SUBSTITUTES & CROSS-REFERENCES 2
EDI8832C45CBReference document
Same NSN cross-reference
Reference document — Advisory reference — outside the item-of-supply concept
IDT71256S45L32BReference document
Same NSN cross-reference
Reference document — Design control — primary reference
LIFECYCLE
NSN statusActive· U.S. Government catalog
Acquisition advice: Insurance item — stocked against contingency demandDemilitarization required — critical (Q)
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FREQUENTLY ASKED QUESTIONS
What is 8511874-757?
8511874-757 is a MICROCIRCUIT,MEMORY.
What parts can replace 8511874-757?
There are 2 known substitutes for 8511874-757: EDI8832C45CB, IDT71256S45L32B. Substitute compatibility should be verified for your specific system.
What is the NSN for 8511874-757?
8511874-757 is cataloged in the U.S. Government catalog under NSN 5962-01-330-5523. This indicates validated use in U.S. government and defense supply chains.
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✓ PartsTable — the parts reference. Every fact cited to its source.
PartsTable Design LLC · partstable.com
U.S. Government catalog: edition PUBLOGDVD v12.0.0 (OCT 2026), edition date 2026-10-01, retrieved 2026-10-18.
PartsTable commercial catalog: edition Unified commercial catalog snapshot through 2026-09-28, edition date not on file, retrieved 2026-09-28.