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Technical Data Sheet
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8507006-200 — MICROCIRCUIT,DIGITAL

✓ Government record, cited
— · COMPONENT
PRODUCT OVERVIEW

8507006-200: MICROCIRCUIT,DIGITAL.

The MICROCIRCUIT,DIGITAL is a the manufacturer industrial component. Key specifications include features_provided: BIPOLAR AND BURN IN AND ELECTROSTATIC SENSITIVE AND PROGRAMMABLE, output_logic_form: TRANSISTOR-TRANSISTOR LOGIC, inclosure_material: CERAMIC, storage_temp_range: -65.0 TO 150.0 CELSIUS DEGC, operating_temp_range: -55.0 TO 125.0 CELSIUS DEGC, inclosure_configuration: LEADLESS FLAT PACK. This part is cataloged in the U.S.

Government catalog under NSN 5962-01-334-9819, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.

Verify compatibility with your specific system configuration before ordering.

WHERE IT FITS
8507006-200
NSN: 5962-01-334-9819
NIINs: 013349819, 013390856
FSC: 5962 — Microcircuits, Electronic
CAGE: 07187 — HONEYWELL INTERNATIONAL INC. DBA HONEYWELL INTERNATIONAL (USA)
SPECIFICATIONS
features_providedBIPOLAR AND BURN IN AND ELECTROSTATIC SENSITIVE AND PROGRAMMABLE
output_logic_formTRANSISTOR-TRANSISTOR LOGIC
inclosure_materialCERAMIC
storage_temp_range-65.0 TO 150.0 CELSIUS DEGC
operating_temp_range-55.0 TO 125.0 CELSIUS DEGC
inclosure_configurationLEADLESS FLAT PACK
design_function_and_quantity1 ARRAY, LOGIC
NSN5962-01-334-9819
COMPONENT DIAGRAM
COMPONENT MAIN IC EDGE CONNECTOR No detailed specs available MICROCIRCUIT,DIGITAL TITLE COMPONENT PN 8507006-200 MFR MICROCIRCUIT,DIGITAL
KEY FEATURES
•
INCLOSURE MATERIAL: CERAMIC
•
DESIGN FUNCTION AND QUANTITY: 1 ARRAY, LOGIC
•
FEATURES PROVIDED: BIPOLAR AND BURN IN AND ELECTROSTATIC SENSITIVE AND PROGRAMMABLE
•
INCLOSURE CONFIGURATION: LEADLESS FLAT PACK
•
STORAGE TEMP RANGE: -65.0 TO 150.0 CELSIUS DEGC
•
OUTPUT LOGIC FORM: TRANSISTOR-TRANSISTOR LOGIC
•
OPERATING TEMP RANGE: -55.0 TO 125.0 CELSIUS DEGC
TECHNICAL CHARACTERISTICS
INCLOSURE MATERIALCERAMIC
DESIGN FUNCTION AND QUANTITY1 ARRAY, LOGIC
FEATURES PROVIDEDBIPOLAR AND BURN IN AND ELECTROSTATIC SENSITIVE AND PROGRAMMABLE
INCLOSURE CONFIGURATIONLEADLESS FLAT PACK
STORAGE TEMP RANGE-65.0 TO 150.0 CELSIUS DEGC
OUTPUT LOGIC FORMTRANSISTOR-TRANSISTOR LOGIC
OPERATING TEMP RANGE-55.0 TO 125.0 CELSIUS DEGC
SUBSTITUTES & CROSS-REFERENCES 2
10136666Reference document
Same NSN cross-reference
Reference document — Informative reference only
ROM/PROMReference document
Same NSN cross-reference
Reference document — Secondary reference
LIFECYCLE
NSN statusActive· U.S. Government catalog
Acquisition advice: Insurance item — stocked against contingency demandDemilitarization required — mutilation + specific procedure
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FREQUENTLY ASKED QUESTIONS
What is 8507006-200?
8507006-200 is a MICROCIRCUIT,DIGITAL.
What parts can replace 8507006-200?
There are 2 known substitutes for 8507006-200: 10136666, ROM/PROM. Substitute compatibility should be verified for your specific system.
What is the NSN for 8507006-200?
8507006-200 is cataloged in the U.S. Government catalog under NSN 5962-01-334-9819. This indicates validated use in U.S. government and defense supply chains.
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