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8507006-152 — MICROCIRCUIT,DIGITAL

✓ Government record, cited
— · COMPONENT
PRODUCT OVERVIEW

8507006-152: MICROCIRCUIT,DIGITAL.

The MICROCIRCUIT,DIGITAL is a the manufacturer industrial component. Key specifications include body_width: 0.662 INCHES MAXIMUM IN, body_height: 0.120 INCHES MAXIMUM IN, body_length: 0.662 INCHES MAXIMUM IN, features_provided: HERMETICALLY SEALED AND BURN IN AND PROGRAMMABLE AND BIDIRECTIONAL AND W/RESET, output_logic_form: COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC, inclosure_material: CERAMIC. This part is cataloged in the U.S.

Government catalog under NSN 5962-01-254-9302, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.

Verify compatibility with your specific system configuration before ordering.

WHERE IT FITS
8507006-152
NSN: 5962-01-254-9302
FSC: 5962 — Microcircuits, Electronic
CAGE: 07187 — HONEYWELL INTERNATIONAL INC. DBA HONEYWELL INTERNATIONAL (USA)
SPECIFICATIONS
body_width0.662 INCHES MAXIMUM IN
body_height0.120 INCHES MAXIMUM IN
body_length0.662 INCHES MAXIMUM IN
features_providedHERMETICALLY SEALED AND BURN IN AND PROGRAMMABLE AND BIDIRECTIONAL AND W/RESET
output_logic_formCOMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC
inclosure_materialCERAMIC
storage_temp_range-65.0 TO 150.0 CELSIUS DEGC
operating_temp_range-55.0 TO 125.0 CELSIUS DEGC
input_circuit_pattern38 INPUT
end_item_identification7025-01-125-6796 MESSAGE DEVICE,
inclosure_configurationLEADLESS FLAT PACK
terminal_surface_treatmentSOLDER
NSN5962-01-254-9302
COMPONENT DIAGRAM
COMPONENT MAIN IC EDGE CONNECTOR No detailed specs available MICROCIRCUIT,DIGITAL TITLE COMPONENT PN 8507006-152 MFR MICROCIRCUIT,DIGITAL
KEY FEATURES
•
INPUT CIRCUIT PATTERN: 38 INPUT
•
INCLOSURE MATERIAL: CERAMIC
•
TERMINAL SURFACE TREATMENT: SOLDER
•
DESIGN FUNCTION AND QUANTITY: 1 PERIPHERAL, INTERFACE
•
BODY WIDTH: 0.662 INCHES MAXIMUM IN
•
BODY HEIGHT: 0.120 INCHES MAXIMUM IN
•
FEATURES PROVIDED: HERMETICALLY SEALED AND BURN IN AND PROGRAMMABLE AND BIDIRECTIONAL AND W/RESET
•
INCLOSURE CONFIGURATION: LEADLESS FLAT PACK
TECHNICAL CHARACTERISTICS
INPUT CIRCUIT PATTERN38 INPUT
INCLOSURE MATERIALCERAMIC
TERMINAL SURFACE TREATMENTSOLDER
DESIGN FUNCTION AND QUANTITY1 PERIPHERAL, INTERFACE
BODY WIDTH0.662 INCHES MAXIMUM IN
BODY HEIGHT0.120 INCHES MAXIMUM IN
FEATURES PROVIDEDHERMETICALLY SEALED AND BURN IN AND PROGRAMMABLE AND BIDIRECTIONAL AND W/RESET
INCLOSURE CONFIGURATIONLEADLESS FLAT PACK
CASE OUTLINE SOURCE AND DESIGNATORC-5 MIL-M-38510
BODY LENGTH0.662 INCHES MAXIMUM IN
SUBSTITUTES & CROSS-REFERENCES 4
10136371Reference document
Same NSN cross-reference
Reference document — Informative reference only
84066Reference document
Same NSN cross-reference
Reference document — Identification reference
8406601XBSame NSN cross-reference
Same NSN cross-reference
Also cataloged under this NSN
MR82C55A-5/BReference document
Same NSN cross-reference
Reference document — Secondary reference
LIFECYCLE
NSN statusActive· U.S. Government catalog
No demilitarization required
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FREQUENTLY ASKED QUESTIONS
What is 8507006-152?
8507006-152 is a MICROCIRCUIT,DIGITAL.
What parts can replace 8507006-152?
There are 4 known substitutes for 8507006-152: 10136371, 84066, 8406601XB and 1 more. Substitute compatibility should be verified for your specific system.
What is the NSN for 8507006-152?
8507006-152 is cataloged in the U.S. Government catalog under NSN 5962-01-254-9302. This indicates validated use in U.S. government and defense supply chains.
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