8507005-233 — MICROCIRCUIT,MEMORY

✓ Government record, cited

— · COMPONENT

PRODUCT OVERVIEW

8507005-233: MICROCIRCUIT,MEMORY.

The MICROCIRCUIT,MEMORY is a the manufacturer memory module engineered for enterprise server and workstation platforms requiring validated, high-reliability memory. Key specifications include body_width: 0.442 INCHES MINIMUM AND 0.458 INCHES MAXIMUM IN, body_height: 0.060 INCHES MINIMUM AND 0.120 INCHES MAXIMUM IN, body_length: 0.540 INCHES MINIMUM AND 0.560 INCHES MAXIMUM IN, bit_quantity: 262144, word_quantity: 32768, features_provided: BIPOLAR AND BURN IN AND ELECTROSTATIC SENSITIVE AND PROGRAMMED. This part is cataloged in the U.S.

Government catalog under NSN 5962-01-348-2932, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.

Verify compatibility with your specific system configuration before ordering.

WHERE IT FITS

8507005-233

NSN: 5962-01-348-2932
FSC: 5962 — Microcircuits, Electronic
CAGE: 07187 — HONEYWELL INTERNATIONAL INC. DBA HONEYWELL INTERNATIONAL (USA)

SPECIFICATIONS

body_width	0.442 INCHES MINIMUM AND 0.458 INCHES MAXIMUM IN
body_height	0.060 INCHES MINIMUM AND 0.120 INCHES MAXIMUM IN
body_length	0.540 INCHES MINIMUM AND 0.560 INCHES MAXIMUM IN
bit_quantity	262144
word_quantity	32768
features_provided	BIPOLAR AND BURN IN AND ELECTROSTATIC SENSITIVE AND PROGRAMMED
output_logic_form	COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC
inclosure_material	CERAMIC
memory_device_type	RAM
storage_temp_range	-65.0 TO 150.0 CELSIUS DEGC
test_data_document	96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.).
operating_temp_range	-55.0 TO 125.0 CELSIUS DEGC
NSN	5962-01-348-2932

COMPONENT DIAGRAM

KEY FEATURES

•

BIT QUANTITY: 262144

•

HYBRID TECHNOLOGY TYPE: MONOLITHIC

•

INPUT CIRCUIT PATTERN: 25 INPUT

•

WORD QUANTITY: 32768

•

INCLOSURE MATERIAL: CERAMIC

•

TERMINAL SURFACE TREATMENT: SOLDER

•

BODY WIDTH: 0.442 INCHES MINIMUM AND 0.458 INCHES MAXIMUM IN

•

BODY HEIGHT: 0.060 INCHES MINIMUM AND 0.120 INCHES MAXIMUM IN

TYPICAL APPLICATIONS

Server memory expansion for virtualization workloads
Database performance optimization (in-memory computing)
VDI and remote desktop session hosting
High-performance computing (HPC) clusters
Mail server and collaboration platform scaling
Application server tier expansion

TECHNICAL CHARACTERISTICS

BIT QUANTITY	262144
HYBRID TECHNOLOGY TYPE	MONOLITHIC
INPUT CIRCUIT PATTERN	25 INPUT
WORD QUANTITY	32768
INCLOSURE MATERIAL	CERAMIC
TERMINAL SURFACE TREATMENT	SOLDER
BODY WIDTH	0.442 INCHES MINIMUM AND 0.458 INCHES MAXIMUM IN
BODY HEIGHT	0.060 INCHES MINIMUM AND 0.120 INCHES MAXIMUM IN
FEATURES PROVIDED	BIPOLAR AND BURN IN AND ELECTROSTATIC SENSITIVE AND PROGRAMMED
INCLOSURE CONFIGURATION	LEADLESS FLAT PACK

SUBSTITUTES & CROSS-REFERENCES 2

5962-8866204YAReference document

Same NSN cross-reference

Reference document — Secondary reference

10133932Reference document

Same NSN cross-reference

Reference document — Informative reference only

LIFECYCLE

NSN statusActive· U.S. Government catalog

Demilitarization required — critical (Q)

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FREQUENTLY ASKED QUESTIONS

What is 8507005-233?

8507005-233 is a MICROCIRCUIT,MEMORY.

What parts can replace 8507005-233?

There are 2 known substitutes for 8507005-233: 5962-8866204YA, 10133932. Substitute compatibility should be verified for your specific system.

What is the NSN for 8507005-233?

8507005-233 is cataloged in the U.S. Government catalog under NSN 5962-01-348-2932. This indicates validated use in U.S. government and defense supply chains.

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8507005-233 — MICROCIRCUIT,MEMORY

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