8507005-183 — MICROCIRCUIT,MEMORY

✓ Government record, cited

— · COMPONENT

PRODUCT OVERVIEW

8507005-183: MICROCIRCUIT,MEMORY.

The MICROCIRCUIT,MEMORY is a the manufacturer memory module engineered for enterprise server and workstation platforms requiring validated, high-reliability memory. Key specifications include features_provided: MONOLITHIC AND PROGRAMMABLE AND ELECTROSTATIC SENSITIVE, output_logic_form: COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC, inclosure_material: CERAMIC, memory_device_type: ROM, inclosure_configuration: LEADLESS FLAT PACK, terminal_surface_treatment: SOLDER. This part is cataloged in the U.S.

Government catalog under NSN 5962-01-334-9822, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.

Verify compatibility with your specific system configuration before ordering.

WHERE IT FITS

8507005-183

NSN: 5962-01-334-9822
NIINs: 013349822, 013349823, 013353514
FSC: 5962 — Microcircuits, Electronic
CAGE: 07187 — HONEYWELL INTERNATIONAL INC. DBA HONEYWELL INTERNATIONAL (USA)

SPECIFICATIONS

features_provided	MONOLITHIC AND PROGRAMMABLE AND ELECTROSTATIC SENSITIVE
output_logic_form	COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC
inclosure_material	CERAMIC
memory_device_type	ROM
inclosure_configuration	LEADLESS FLAT PACK
terminal_surface_treatment	SOLDER
terminal_type_and_quantity	28 LEADLESS
NSN	5962-01-334-9822

COMPONENT DIAGRAM

KEY FEATURES

•

INCLOSURE MATERIAL: CERAMIC

•

TERMINAL SURFACE TREATMENT: SOLDER

•

FEATURES PROVIDED: MONOLITHIC AND PROGRAMMABLE AND ELECTROSTATIC SENSITIVE

•

INCLOSURE CONFIGURATION: LEADLESS FLAT PACK

•

MEMORY DEVICE TYPE: ROM

•

OUTPUT LOGIC FORM: COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC

•

TERMINAL TYPE AND QUANTITY: 28 LEADLESS

TYPICAL APPLICATIONS

Server memory expansion for virtualization workloads
Database performance optimization (in-memory computing)
VDI and remote desktop session hosting
High-performance computing (HPC) clusters
Mail server and collaboration platform scaling
Application server tier expansion

TECHNICAL CHARACTERISTICS

INCLOSURE MATERIAL	CERAMIC
TERMINAL SURFACE TREATMENT	SOLDER
FEATURES PROVIDED	MONOLITHIC AND PROGRAMMABLE AND ELECTROSTATIC SENSITIVE
INCLOSURE CONFIGURATION	LEADLESS FLAT PACK
MEMORY DEVICE TYPE	ROM
OUTPUT LOGIC FORM	COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC
TERMINAL TYPE AND QUANTITY	28 LEADLESS

SUBSTITUTES & CROSS-REFERENCES 2

10133868Reference document

Same NSN cross-reference

Reference document — Informative reference only

ROM/PROMReference document

Same NSN cross-reference

Reference document — Secondary reference

LIFECYCLE

NSN statusActive· U.S. Government catalog

Acquisition advice: Insurance item — stocked against contingency demandDemilitarization required — critical (Q)

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FREQUENTLY ASKED QUESTIONS

What is 8507005-183?

8507005-183 is a MICROCIRCUIT,MEMORY.

What parts can replace 8507005-183?

There are 2 known substitutes for 8507005-183: 10133868, ROM/PROM. Substitute compatibility should be verified for your specific system.

What is the NSN for 8507005-183?

8507005-183 is cataloged in the U.S. Government catalog under NSN 5962-01-334-9822. This indicates validated use in U.S. government and defense supply chains.

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