850003-0001: MICROCIRCUIT,DIGITAL.
The MICROCIRCUIT,DIGITAL is a the manufacturer industrial component. Key specifications include body_width: 0.550 INCHES MAXIMUM IN, body_height: 0.180 INCHES MAXIMUM IN, body_length: 1.290 INCHES MAXIMUM IN, features_provided: ERASABLE AND HERMETICALLY SEALED AND LOW POWER, output_logic_form: COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC, inclosure_material: CERAMIC. This part is cataloged in the U.S.
Government catalog under NSN 5962-01-107-1081, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.
Verify compatibility with your specific system configuration before ordering.
| body_width | 0.550 INCHES MAXIMUM IN |
| body_height | 0.180 INCHES MAXIMUM IN |
| body_length | 1.290 INCHES MAXIMUM IN |
| features_provided | ERASABLE AND HERMETICALLY SEALED AND LOW POWER |
| output_logic_form | COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC |
| inclosure_material | CERAMIC |
| memory_device_type | ROM |
| storage_temp_range | -65.0 TO 150.0 CELSIUS DEGC |
| test_data_document | 96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.). |
| operating_temp_range | -55.0 TO 125.0 CELSIUS DEGC |
| input_circuit_pattern | 11 INPUT |
| inclosure_configuration | DUAL-IN-LINE |
| NSN | 5962-01-107-1081 |
| INPUT CIRCUIT PATTERN | 12 INPUT |
| INCLOSURE MATERIAL | CERAMIC AND GLASS |
| TERMINAL SURFACE TREATMENT | SOLDER |
| BODY WIDTH | 0.610 INCHES MAXIMUM IN |
| BODY HEIGHT | 0.225 INCHES MAXIMUM IN |
| FEATURES PROVIDED | HERMETICALLY SEALED AND MONOLITHIC AND POSITIVE OUTPUTS AND W/ENABLE AND PROGRAMMABLE AND W/BUFFERED OUTPUT AND W/STORAGE AND W/STROBE |
| INCLOSURE CONFIGURATION | DUAL-IN-LINE |
| BODY LENGTH | 1.350 INCHES MAXIMUM IN |
| STORAGE TEMP RANGE | -65.0 TO 150.0 CELSIUS DEGC |
| OUTPUT LOGIC FORM | COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC |