8417232: MICROCIRCUIT,MEMORY.
The MICROCIRCUIT,MEMORY is a the manufacturer memory module engineered for enterprise server and workstation platforms requiring validated, high-reliability memory. Key specifications include material: STEEL COMP 1020 OVERALL, thickness: 0.133 INCHES MINIMUM AND 0.135 INCHES MAXIMUM IN, hole_diameter: 1.005 INCHES MINIMUM AND 1.010 INCHES MAXIMUM IN, surface_finish: 63.0 MICROINCHES BOTTOM, hardness_rating: 60.0 ROCKWELL C MINIMUM, overall_diameter: 1.552 INCHES MINIMUM AND 1.652 INCHES MAXIMUM IN. This part is cataloged in the U.S.
Government catalog under NSN 5310-00-607-7116, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.
Verify compatibility with your specific system configuration before ordering.
| material | STEEL COMP 1020 OVERALL |
| thickness | 0.133 INCHES MINIMUM AND 0.135 INCHES MAXIMUM IN |
| hole_diameter | 1.005 INCHES MINIMUM AND 1.010 INCHES MAXIMUM IN |
| surface_finish | 63.0 MICROINCHES BOTTOM |
| hardness_rating | 60.0 ROCKWELL C MINIMUM |
| overall_diameter | 1.552 INCHES MINIMUM AND 1.652 INCHES MAXIMUM IN |
| peripheral_shape_style | ROUND |
| center_hole_shape_style | ROUND |
| cross-sectional_shape_style | RECTANGULAR |
| material_document_and_classification | QQ-S-634 FED SPEC SINGLE MATERIAL RESPONSE OVERALL |
| NSN | 5310-00-607-7116 |
| SURFACE FINISH | 63.0 MICROINCHES BOTTOM |
| SURFACE FINISH | 63.0 MICROINCHES TOP |
| OVERALL DIAMETER | 1.552 INCHES MINIMUM AND 1.652 INCHES MAXIMUM IN |
| HARDNESS RATING | 60.0 ROCKWELL C MINIMUM |
| MATERIAL DOCUMENT AND CLASSIFICATION | QQ-S-634 FED SPEC SINGLE MATERIAL RESPONSE OVERALL |
| CROSS-SECTIONAL SHAPE STYLE | RECTANGULAR |
| PERIPHERAL SHAPE STYLE | ROUND |
| MATERIAL | STEEL COMP 1020 OVERALL |
| CENTER HOLE SHAPE STYLE | ROUND |
| HOLE DIAMETER | 1.005 INCHES MINIMUM AND 1.010 INCHES MAXIMUM IN |
No substitute or cross-reference records for this part.