The SEMICONDUCTOR DEVICE,DIODE is a the manufacturer industrial component. Key specifications include material: SILICON SEMICONDUCTOR, overall_length: 0.450 INCHES MAXIMUM IN, mounting_method: THREADED STUD(S), features_provided: HERMETICALLY SEALED CASE, nominal_thread_size: 0.250 INCHES IN, thread_series_designator: UNF. This part is cataloged in the Federal Logistics Information System (FLIS) under NSN 5961-00-892-0888, indicating validated use in U.S.
government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels. Verify compatibility with your specific system configuration before ordering.
| material | SILICON SEMICONDUCTOR |
| overall_length | 0.450 INCHES MAXIMUM IN |
| mounting_method | THREADED STUD(S) |
| features_provided | HERMETICALLY SEALED CASE |
| nominal_thread_size | 0.250 INCHES IN |
| thread_series_designator | UNF |
| mounting_facility_quantity | 1 |
| overall_width_across_flats | 0.667 INCHES MINIMUM AND 0.687 INCHES MAXIMUM IN |
| terminal_type_and_quantity | 1 TAB, SOLDER LUG AND 1 THREADED STUD |
| specification/standard_data | 81349-MIL-S-19500/297 GOVERNMENT SPECIFICATION |
| current_rating_per_characteristic | 35.00 AMPERES MAXIMUM AVERAGE FORWARD CURRENT AVERAGED OVER A FULL 60-HZ CYCLE |
| voltage_rating_in_volts_per_characteristic | 720.0 MAXIMUM REVERSE VOLTAGE, INSTANTANEOUS |
| NSN | 5961-00-892-0888 |
| TERMINAL TYPE AND QUANTITY | 1 TAB, SOLDER LUG AND 1 THREADED STUD |
| THREAD SERIES DESIGNATOR | UNF |
| TEST DATA DOCUMENT | 81349-MIL-S-19500 SPECIFICATION (INCLUDES ENGINEERING TYPE BULLETINS, BROCHURES,ETC., THAT REFLECT SPECIFICATION TYPE DATA IN SPECIFICATION FORMAT; EXCLUDES COMMERCIAL CATALOGS, INDUSTRY DIRECTORIES, AND SIMILAR TRADE PUBLICATIONS, REFLECTING GENERAL TYPE DATA ON CERTAIN ENVIRONMENTAL AND PERFORMANCE REQUIREMENTS AND TEST CONDITIONS THAT ARE SHOWN AS "TYPICAL", "AVERAGE", "NOMINAL", ETC.). |
| FEATURES PROVIDED | HERMETICALLY SEALED CASE |
| SPECIFICATION/STANDARD DATA | 81349-MIL-S-19500/297 GOVERNMENT SPECIFICATION |
| MATERIAL | SILICON SEMICONDUCTOR |
| MOUNTING FACILITY QUANTITY | 1 |
| OVERALL WIDTH ACROSS FLATS | 0.667 INCHES MINIMUM AND 0.687 INCHES MAXIMUM IN |
| MOUNTING METHOD | THREADED STUD(S) |
| MAXIMUM OPERATING TEMP PER MEASUREMENT POINT | 150.0 CELSIUS AMBIENT AIR DEGC |