84067012B — MICROCIRCUIT,DIGITAL

✓ Government record, cited

— · COMPONENT

PRODUCT OVERVIEW

84067012B: MICROCIRCUIT,DIGITAL.

The MICROCIRCUIT,DIGITAL is a the manufacturer industrial component. Key specifications include body_width: 0.358 INCHES MAXIMUM IN, body_height: 0.100 INCHES MAXIMUM IN, body_length: 0.358 INCHES MAXIMUM IN, features_provided: HERMETICALLY SEALED AND BURN IN AND MONOLITHIC AND W/STROBE AND W/ENABLE, output_logic_form: COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC, inclosure_material: CERAMIC. This part is cataloged in the U.S.

Government catalog under NSN 5962-01-258-7479, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.

Verify compatibility with your specific system configuration before ordering.

WHERE IT FITS

84067012B

NSN: 5962-01-258-7479
FSC: 5962 — Microcircuits, Electronic
CAGE: 67268 — DLA LAND AND MARITIME DBA ENGINEERING AND TECHNICAL SUPPORT DIV DOCUMENT STANDARDIZATION DIVISION (STANDARD MICROCIRCUIT (USA)

SPECIFICATIONS

body_width	0.358 INCHES MAXIMUM IN
body_height	0.100 INCHES MAXIMUM IN
body_length	0.358 INCHES MAXIMUM IN
features_provided	HERMETICALLY SEALED AND BURN IN AND MONOLITHIC AND W/STROBE AND W/ENABLE
output_logic_form	COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC
inclosure_material	CERAMIC
storage_temp_range	-65.0 TO 150.0 CELSIUS DEGC
operating_temp_range	-55.0 TO 125.0 CELSIUS DEGC
input_circuit_pattern	10 INPUT
inclosure_configuration	LEADLESS FLAT PACK
terminal_surface_treatment	SOLDER
terminal_type_and_quantity	20 LEADLESS
NSN	5962-01-258-7479

COMPONENT DIAGRAM

KEY FEATURES

•

INPUT CIRCUIT PATTERN: 10 INPUT

•

INCLOSURE MATERIAL: CERAMIC

•

TERMINAL SURFACE TREATMENT: SOLDER

•

DESIGN FUNCTION AND QUANTITY: 8 DRIVER, BUS

•

BODY WIDTH: 0.358 INCHES MAXIMUM IN

•

BODY HEIGHT: 0.100 INCHES MAXIMUM IN

•

FEATURES PROVIDED: HERMETICALLY SEALED AND BURN IN AND MONOLITHIC AND W/STROBE AND W/ENABLE

•

INCLOSURE CONFIGURATION: LEADLESS FLAT PACK

TECHNICAL CHARACTERISTICS

INPUT CIRCUIT PATTERN	10 INPUT
INCLOSURE MATERIAL	CERAMIC
TERMINAL SURFACE TREATMENT	SOLDER
DESIGN FUNCTION AND QUANTITY	8 DRIVER, BUS
BODY WIDTH	0.358 INCHES MAXIMUM IN
BODY HEIGHT	0.100 INCHES MAXIMUM IN
FEATURES PROVIDED	HERMETICALLY SEALED AND BURN IN AND MONOLITHIC AND W/STROBE AND W/ENABLE
INCLOSURE CONFIGURATION	LEADLESS FLAT PACK
CASE OUTLINE SOURCE AND DESIGNATOR	C-2 MIL-M-38510
BODY LENGTH	0.358 INCHES MAXIMUM IN

SUBSTITUTES & CROSS-REFERENCES 5

MR82C82/BReference document

Same NSN cross-reference

Reference document — Secondary reference

84067Reference document

Same NSN cross-reference

Reference document — Identification reference

84067012XReference document

Same NSN cross-reference

Reference document — Secondary reference

84067012ASame NSN cross-reference

Same NSN cross-reference

Also cataloged under this NSN

84067012CReference document

Same NSN cross-reference

Reference document — Secondary reference

LIFECYCLE

NSN statusCancelled· U.S. Government catalog

Acquisition advice: Insurance item — stocked against contingency demandDemilitarization required — critical (Q)

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FREQUENTLY ASKED QUESTIONS

What is 84067012B?

84067012B is a MICROCIRCUIT,DIGITAL.

What parts can replace 84067012B?

There are 5 known substitutes for 84067012B: MR82C82/B, 84067, 84067012X and 2 more. Substitute compatibility should be verified for your specific system.

What is the NSN for 84067012B?

84067012B is cataloged in the U.S. Government catalog under NSN 5962-01-258-7479. This indicates validated use in U.S. government and defense supply chains.

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84067012B — MICROCIRCUIT,DIGITAL

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