8403609XX: MICROCIRCUIT,MEMORY.
The MICROCIRCUIT,MEMORY is a the manufacturer memory module engineered for enterprise server and workstation platforms requiring validated, high-reliability memory. Key specifications include body_width: 0.458 INCHES NOMINAL IN, body_height: 0.120 INCHES NOMINAL IN, body_length: 0.560 INCHES NOMINAL IN, output_logic_form: COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC, memory_device_type: RAM, storage_temp_range: -55.0 TO 150.0 CELSIUS DEGC. This part is cataloged in the U.S.
Government catalog under NSN 5962-01-398-3532, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.
Verify compatibility with your specific system configuration before ordering.
| body_width | 0.458 INCHES NOMINAL IN |
| body_height | 0.120 INCHES NOMINAL IN |
| body_length | 0.560 INCHES NOMINAL IN |
| output_logic_form | COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC |
| memory_device_type | RAM |
| storage_temp_range | -55.0 TO 150.0 CELSIUS DEGC |
| operating_temp_range | -55.0 TO 125.0 CELSIUS DEGC |
| inclosure_configuration | LEADLESS FLAT PACK |
| terminal_surface_treatment | SOLDER |
| terminal_type_and_quantity | 32 LEADLESS |
| maximum_power_dissipation_rating | 1.0 WATTS |
| current_rating_per_characteristic | 120.00 MILLIAMPERES MAXIMUM SUPPLY |
| NSN | 5962-01-398-3532 |
| TERMINAL SURFACE TREATMENT | SOLDER |
| BODY WIDTH | 0.458 INCHES NOMINAL IN |
| BODY HEIGHT | 0.120 INCHES NOMINAL IN |
| INCLOSURE CONFIGURATION | LEADLESS FLAT PACK |
| CURRENT RATING PER CHARACTERISTIC | 120.00 MILLIAMPERES MAXIMUM SUPPLY |
| MEMORY DEVICE TYPE | RAM |
| BODY LENGTH | 0.560 INCHES NOMINAL IN |
| STORAGE TEMP RANGE | -55.0 TO 150.0 CELSIUS DEGC |
| OUTPUT LOGIC FORM | COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC |
| VOLTAGE RATING AND TYPE PER CHARACTERISTIC | -0.3 VOLTS MINIMUM POWER SOURCE AND 7.0 VOLTS MAXIMUM POWER SOURCE |