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8403609XX — MICROCIRCUIT,MEMORY

✓ Government record, cited
— · COMPONENT
PRODUCT OVERVIEW

8403609XX: MICROCIRCUIT,MEMORY.

The MICROCIRCUIT,MEMORY is a the manufacturer memory module engineered for enterprise server and workstation platforms requiring validated, high-reliability memory. Key specifications include body_width: 0.458 INCHES NOMINAL IN, body_height: 0.120 INCHES NOMINAL IN, body_length: 0.560 INCHES NOMINAL IN, output_logic_form: COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC, memory_device_type: RAM, storage_temp_range: -55.0 TO 150.0 CELSIUS DEGC. This part is cataloged in the U.S.

Government catalog under NSN 5962-01-398-3532, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.

Verify compatibility with your specific system configuration before ordering.

WHERE IT FITS
8403609XX
NSN: 5962-01-398-3532
FSC: 5962 — Microcircuits, Electronic
CAGE: 16236 — DLA LAND AND MARITIME DBA ENGINEERING AND TECHNICAL SUPPORT DIV DOCUMENT STANDARDIZATION DIVISION (VENDOR ITEM DRAWINGS) (USA)
SPECIFICATIONS
body_width0.458 INCHES NOMINAL IN
body_height0.120 INCHES NOMINAL IN
body_length0.560 INCHES NOMINAL IN
output_logic_formCOMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC
memory_device_typeRAM
storage_temp_range-55.0 TO 150.0 CELSIUS DEGC
operating_temp_range-55.0 TO 125.0 CELSIUS DEGC
inclosure_configurationLEADLESS FLAT PACK
terminal_surface_treatmentSOLDER
terminal_type_and_quantity32 LEADLESS
maximum_power_dissipation_rating1.0 WATTS
current_rating_per_characteristic120.00 MILLIAMPERES MAXIMUM SUPPLY
NSN5962-01-398-3532
COMPONENT DIAGRAM
COMPONENT MAIN IC EDGE CONNECTOR No detailed specs available MICROCIRCUIT,MEMORY TITLE COMPONENT PN 8403609XX MFR MICROCIRCUIT,MEMORY
KEY FEATURES
•
TERMINAL SURFACE TREATMENT: SOLDER
•
BODY WIDTH: 0.458 INCHES NOMINAL IN
•
BODY HEIGHT: 0.120 INCHES NOMINAL IN
•
INCLOSURE CONFIGURATION: LEADLESS FLAT PACK
•
CURRENT RATING PER CHARACTERISTIC: 120.00 MILLIAMPERES MAXIMUM SUPPLY
•
MEMORY DEVICE TYPE: RAM
•
BODY LENGTH: 0.560 INCHES NOMINAL IN
•
STORAGE TEMP RANGE: -55.0 TO 150.0 CELSIUS DEGC
TYPICAL APPLICATIONS
  • Server memory expansion for virtualization workloads
  • Database performance optimization (in-memory computing)
  • VDI and remote desktop session hosting
  • High-performance computing (HPC) clusters
  • Mail server and collaboration platform scaling
  • Application server tier expansion
TECHNICAL CHARACTERISTICS
TERMINAL SURFACE TREATMENTSOLDER
BODY WIDTH0.458 INCHES NOMINAL IN
BODY HEIGHT0.120 INCHES NOMINAL IN
INCLOSURE CONFIGURATIONLEADLESS FLAT PACK
CURRENT RATING PER CHARACTERISTIC120.00 MILLIAMPERES MAXIMUM SUPPLY
MEMORY DEVICE TYPERAM
BODY LENGTH0.560 INCHES NOMINAL IN
STORAGE TEMP RANGE-55.0 TO 150.0 CELSIUS DEGC
OUTPUT LOGIC FORMCOMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC
VOLTAGE RATING AND TYPE PER CHARACTERISTIC-0.3 VOLTS MINIMUM POWER SOURCE AND 7.0 VOLTS MAXIMUM POWER SOURCE
OTHER ITEMS IN FSC 5962 — Microcircuits, Electronic
Items in the same Federal Supply class. No interchangeability or substitution relationship is implied.
5962-00-001-1861 5962-00-001-1901 5962-00-001-1902 5962-00-001-1905 5962-00-001-1906 5962-00-001-1907 5962-00-001-1908 5962-00-001-1909
SUBSTITUTES & CROSS-REFERENCES 2
8403609XASame NSN cross-reference
Same NSN cross-reference
Also cataloged under this NSN
84036Reference document
Same NSN cross-reference
Reference document — Identification reference
LIFECYCLE
NSN statusActive· U.S. Government catalog
Acquisition advice: Insurance item — stocked against contingency demandDemilitarization required — mutilation + specific procedure
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FREQUENTLY ASKED QUESTIONS
What is 8403609XX?
8403609XX is a MICROCIRCUIT,MEMORY.
What parts can replace 8403609XX?
There are 2 known substitutes for 8403609XX: 8403609XA, 84036. Substitute compatibility should be verified for your specific system.
What is the NSN for 8403609XX?
8403609XX is cataloged in the U.S. Government catalog under NSN 5962-01-398-3532. This indicates validated use in U.S. government and defense supply chains.
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