84010013X: MICROCIRCUIT,DIGITAL.
The MICROCIRCUIT,DIGITAL is a the manufacturer industrial component. Key specifications include body_width: 0.442 INCHES MINIMUM AND 0.460 INCHES MAXIMUM IN, body_height: 0.060 INCHES MINIMUM AND 0.100 INCHES MAXIMUM IN, body_length: 0.442 INCHES MINIMUM AND 0.460 INCHES MAXIMUM IN, features_provided: BURN IN AND LOW POWER AND MONOLITHIC AND SCHOTTKY, output_logic_form: TRANSISTOR-TRANSISTOR LOGIC, inclosure_material: CERAMIC. This part is cataloged in the U.S.
Government catalog under NSN 5998-01-314-5874, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.
Verify compatibility with your specific system configuration before ordering.
| body_width | 0.442 INCHES MINIMUM AND 0.460 INCHES MAXIMUM IN |
| body_height | 0.060 INCHES MINIMUM AND 0.100 INCHES MAXIMUM IN |
| body_length | 0.442 INCHES MINIMUM AND 0.460 INCHES MAXIMUM IN |
| features_provided | BURN IN AND LOW POWER AND MONOLITHIC AND SCHOTTKY |
| output_logic_form | TRANSISTOR-TRANSISTOR LOGIC |
| inclosure_material | CERAMIC |
| storage_temp_range | -65.0 TO 150.0 CELSIUS DEGC |
| test_data_document | 96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.). |
| operating_temp_range | -55.0 TO 125.0 CELSIUS DEGC |
| input_circuit_pattern | 14 INPUT |
| inclosure_configuration | LEADLESS FLAT PACK |
| terminal_surface_treatment | SOLDER |
| NSN | 5998-01-314-5874 |
| SPECIAL FEATURES | PRINTED WIRING BOARD 1; RESISTOR 19; CAPACITOR 12; DIODE 4; RESISTOR 1; TRANSISTOR 1; MICROCIRCUIT 5 |
No substitute or cross-reference records for this part.