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83711-80019 — MICROCIRCUIT,MEMORY

✓ Government record, cited
— · COMPONENT
PRODUCT OVERVIEW

83711-80019: MICROCIRCUIT,MEMORY.

The MICROCIRCUIT,MEMORY is a the manufacturer memory module engineered for enterprise server and workstation platforms requiring validated, high-reliability memory. Key specifications include body_width: 13.0 MILLIMETERS NOMINAL MM, body_height: 5.0 MILLIMETERS NOMINAL MM, body_length: 37.0 MILLIMETERS NOMINAL MM, output_logic_form: N-TYPE METAL OXIDE-SEMICONDUCTOR LOGIC, inclosure_material: CERAMIC, memory_device_type: EPROM. This part is cataloged in the U.S.

Government catalog under NSN 5962-01-443-7167, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.

Verify compatibility with your specific system configuration before ordering.

WHERE IT FITS
83711-80019
NSN: 5962-01-443-7167
FSC: 5962 — Microcircuits, Electronic
CAGE: 7ZXR5 — KEYSIGHT TECHNOLOGIES INC (USA)
SPECIFICATIONS
body_width13.0 MILLIMETERS NOMINAL MM
body_height5.0 MILLIMETERS NOMINAL MM
body_length37.0 MILLIMETERS NOMINAL MM
output_logic_formN-TYPE METAL OXIDE-SEMICONDUCTOR LOGIC
inclosure_materialCERAMIC
memory_device_typeEPROM
operating_temp_range-25.0 TO 125.0 CELSIUS DEGC
inclosure_configurationDUAL-IN-LINE
time_rating_per_chacteristic450.00 NANOSECONDS NOMINAL ACCESS NS
NSN5962-01-443-7167
COMPONENT DIAGRAM
COMPONENT MAIN IC EDGE CONNECTOR No detailed specs available MICROCIRCUIT,MEMORY TITLE COMPONENT PN 83711-80019 MFR MICROCIRCUIT,MEMORY
KEY FEATURES
•
INCLOSURE MATERIAL: CERAMIC
•
BODY WIDTH: 13.0 MILLIMETERS NOMINAL MM
•
BODY HEIGHT: 5.0 MILLIMETERS NOMINAL MM
•
INCLOSURE CONFIGURATION: DUAL-IN-LINE
•
MEMORY DEVICE TYPE: EPROM
•
BODY LENGTH: 37.0 MILLIMETERS NOMINAL MM
•
OUTPUT LOGIC FORM: N-TYPE METAL OXIDE-SEMICONDUCTOR LOGIC
•
OPERATING TEMP RANGE: -25.0 TO 125.0 CELSIUS DEGC
TYPICAL APPLICATIONS
  • Server memory expansion for virtualization workloads
  • Database performance optimization (in-memory computing)
  • VDI and remote desktop session hosting
  • High-performance computing (HPC) clusters
  • Mail server and collaboration platform scaling
  • Application server tier expansion
TECHNICAL CHARACTERISTICS
INCLOSURE MATERIALCERAMIC
BODY WIDTH13.0 MILLIMETERS NOMINAL MM
BODY HEIGHT5.0 MILLIMETERS NOMINAL MM
INCLOSURE CONFIGURATIONDUAL-IN-LINE
MEMORY DEVICE TYPEEPROM
BODY LENGTH37.0 MILLIMETERS NOMINAL MM
OUTPUT LOGIC FORMN-TYPE METAL OXIDE-SEMICONDUCTOR LOGIC
OPERATING TEMP RANGE-25.0 TO 125.0 CELSIUS DEGC
TERMINAL TYPE AND QUANTITY28 PRINTED CIRCUIT
TIME RATING PER CHACTERISTIC450.00 NANOSECONDS NOMINAL ACCESS NS
OTHER ITEMS IN FSC 5962 — Microcircuits, Electronic
Items in the same Federal Supply class. No interchangeability or substitution relationship is implied.
5962-00-001-1861 5962-00-001-1901 5962-00-001-1902 5962-00-001-1905 5962-00-001-1906 5962-00-001-1907 5962-00-001-1908 5962-00-001-1909
SUBSTITUTES & CROSS-REFERENCES 1
ROM/PROMReference document
Same NSN cross-reference
Reference document — Secondary reference
LIFECYCLE
NSN statusActive· U.S. Government catalog
Acquisition advice: Insurance item — stocked against contingency demandNo demilitarization required
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FREQUENTLY ASKED QUESTIONS
What is 83711-80019?
83711-80019 is a MICROCIRCUIT,MEMORY.
What parts can replace 83711-80019?
There is 1 known substitute for 83711-80019: ROM/PROM. Substitute compatibility should be verified for your specific system.
What is the NSN for 83711-80019?
83711-80019 is cataloged in the U.S. Government catalog under NSN 5962-01-443-7167. This indicates validated use in U.S. government and defense supply chains.
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